Hole-surface copper integrated thickness measuring device and thickness measuring method for five-terminal measurement of micro resistance

Abstract

The invention relates to the technical field of metal thickness measurement and discloses a hole-surface copper integrated thickness measuring device and a thickness measuring method for five-terminalmeasurement of micro resistance. The thickness measuring device mainly comprises two clamps which are symmetrically arranged in an up-down mode. The clamp further comprises two air cylinders, a mounting plate for mounting the air cylinders, a protection flat plate and a five-terminal thickness measuring probe. The thickness measuring method comprises the steps that the five-terminal thickness measuring probes of the two clamps are moved to a measuring position, four probe pins on the five-terminal thickness measuring probes are used for measuring the thickness of an upper copper layer and a lower copper layer, a hole wall copper thickness measuring assembly is used for measuring the voltage of a hole wall copper layer in an up-and-down combined mode, and then the resistance is calculated.The thickness of the hole wall copper layer is calculated according to the diameter, height and resistance of the hole wall copper layer and the thickness of the upper copper layer and the lower copper layer. According to the device and the method in the invention, two kinds of hole copper parameters can be measured at the same time in one device, and the measurement process is simplified.

Description

technical field [0001] The invention relates to the technical field of metal thickness measurement, in particular to a hole surface copper integrated thickness measurement device and a thickness measurement method for five-terminal microresistors Background technique [0002] With the development of electronic technology, circuit boards are used more and more widely, and the thickness of the copper layer on the surface of the circuit board and the copper layer on the hole wall will directly affect the signal integrity of the high-frequency high-speed circuit board, affecting such as signal-to-noise ratio , the video transmission rate. At present, only the online measurement of the surface copper layer thickness is realized, and the manual measurement method is still used for the hole wall copper layer thickness. The principles are different, the probes cannot be shared, and must be measured separately, which not only affects the production capacity, but also requires a larg...

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Problems solved by technology

[0007] In view of the deficiencies in the background technology, the present invention provides an integrated thickness measuring device for copper on the hole surface and a method for measuring the thickness of the five-terminal micro-resistance. The technical problem to be solved is the thickness of the surface copper layer and the thickness of the hole wall in the prior art. Separate measurement of copper layer thickness, inconvenient measurement, poor anti-interference and inability to measure copper holes with a diameter less than 0.7mm

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