Method and device for transporting an arrangement of flexible circuit substrates during the production of a laminate therefrom
A circuit substrate and flexible circuit technology, which is applied in transportation and packaging, circuits, semiconductor/solid-state device manufacturing, etc., can solve the problems of flexible circuit substrates such as undesirable deformation and bending difficulties, so as to avoid absolute or relative movement, high The effect of manufacturing yield
Active Publication Date: 2019-10-08
MUEHLBAUEHR AG
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Problems solved by technology
[0005] However, this is often made difficult by the fact that the individual flexible circuit substrates can have undesired deformations, especially bending, due to their flexibility
Method used
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[0041] figure 1 The transport device 1 shown in has a transport belt 2 for transporting substrates which extends between two rollers 3 a and 3 b and is driven by the pair of rollers. The conveyor belt 2 is air-permeable, for which purpose it can in particular have perforations and / or can be made of a porous material. On the first side of the conveyor belt 2 (on figure 1 This is the upper side of the conveyor belt), a plurality of circuit substrates 7 are arranged in a regular tile structure so that each adjacent circuit substrate 7 partially overlaps. The overlapping regions are used to securely connect the individual circuit substrates 7 to each other not only mechanically but also electrically during the course of the production method described later. For this purpose, the circuit substrate 7 has electrical contact surfaces 8 in the overlapping region (only some of these contact surfaces are shown here for the sake of clarity), which contact surfaces can each be connected...
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The invention relates to a method and a device for transporting an arrangement of flexible circuit substrates produced on a transport substrate during the production of a laminate from the arranged circuit substrates, as well as building thereon, a method and a device for producing a laminate of flexible circuit substrates. In the method, a film is applied to the arranged circuit substrates on theside thereof opposite the transport substrate, with the result that the film comes to lie over the transport substrate in at least two sections that are separate from each other and are not covered by a circuit substrate, and runs between them continuously over at least one of the circuit substrates. Then, the arranged circuit substrates are fixed on the transport substrate by means of the generation of a negative pressure acting on the arrangement of the circuit substrates, and which, at least in sections, directly impinges on the arrangement of the circuit substrates itself as well as, at least in sections, additionally on the film (6) and thereby in turn indirectly on at least one of the circuit substrates in the direction of the transport substrate with a pressing force with respect to the transport substrate. Then, the arrangement of circuit substrates fixed on the transport substrate by means of the pressing force is transported by moving the transport substrate.
Description
technical field [0001] The invention relates to a method and a device for transporting arrays of flexible circuit substrates, in particular arrays of flexible solar cells, positioned on a transport substrate during the manufacture of a composite body of arranged circuit substrates, and A method and a device for manufacturing a flexible circuit substrate complex, especially a flexible solar cell complex, constructed on this basis. Background technique [0002] In addition to rigid circuit substrates, such as conventional printed circuit boards (English: Printed circuit board, PCB) and semiconductor circuits, in particular conventional integrated circuits, are also known for a range of different applications (also including solar technology) In) flexible circuit substrates, such as flexible semiconductor circuit substrates or multi-layer film substrates. [0003] A "flexible circuit substrate" in the sense of the present invention is a substrate which carries an electrical ci...
Claims
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Login to View More IPC IPC(8): H01L21/677H01L31/18
CPCH01L21/67703H01L31/18H01L21/67132H01L21/67706H01L21/67721H01L21/6838H01L31/02H01L31/1876H01L31/188
Inventor V·布罗德K·施伦佩尔D·伯格曼
Owner MUEHLBAUEHR AG