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Electronic module

A technology of electronic modules and electronic components, applied in the direction of circuits, dielectric properties, printed circuits, etc., can solve the problems of limiting the data transmission speed of explosion safety interfaces, slowing down programming and manufacturing steps, etc.

Pending Publication Date: 2019-10-08
EHNDRESS KHAUZER GMBKH KO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the data transmission speed of this explosion-safe interface is also limited
However, in the case of manufacturing electronic modules, this is disadvantageous because it significantly slows down the manufacturing step of programming (also called "flashing"): when programming of electronic modules (usually based on microcontrollers or FPGA) e.g. via a suitable non-explosion-proof, JTAG- or "Spy Bi Wire" interface takes place within seconds, e.g. a suitable data transfer via an explosion-resistant digital interface takes more than 10 minutes

Method used

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  • Electronic module

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Embodiment Construction

[0022] figure 1 A possible form of embodiment of the electronic module 1 of the invention is shown. It is essentially based on electronic components 11 arranged on a circuit board 15 . The electronic component 11 can be, for example, a microcontroller. The electronics module 1 is encapsulated by a (pressurized) enclosure 13 so that with a corresponding design of the enclosure 13 the electronics module 1 can be used in areas at risk of explosion. In the shown example of embodiment, the encapsulation 13 encapsulates all these components 11 , 12 on the circuit board 15 , which is located with respect to the circuit board 15 on the side containing the electronic components 11 . As a result of the encapsulation 13 , the electronic module 1 is thus suitable for use in field devices, for example.

[0023] exist figure 1 In the case of the illustration shown in , the electronic module 1 comprises an explosion-resistant interface 16 via which at least one electronic component 11 ca...

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Abstract

The invention relates to an explosion-proof electronic module (1) having a fast interface, and to a method for establishing electronic contact with said electronic module (1) via said interface. For this purpose, in addition to an electronic component (11), it comprises at least one electrical contact surface (12) for establishing electrical contact with said component (11), and also comprises anenclosure (13), which encloses at least the at least one electrical contact surface (12). The enclosure (13) here is configured, at least in a sub-region (131), such that contact can be established with the at least one contact surface (12) by means of at least one electrical contact pin (2), wherein the enclosure (13) is filled with an encapsulating compound (14) at least between the at least onecontact surface (12) and the sub-region (131). Therefore, the one or more electrical contact surfaces (12) give rise, according to the invention, to a physical interface to the electronic module (1)which, while not being subjected to the restrictions in respect of the explosion-protection-induced maximum transmission speed, can nevertheless provide explosion protection because it is reclosed bythe self-reclosing encapsulating compound (14) once the contact pin (2) has been removed.

Description

technical field [0001] The invention relates to an electronic module and a method for electrical contacting of such an electronic module. Background technique [0002] In automation technology, especially in process automation technology, field devices are often used which are used to record and / or influence process variables. For recording process variables, sensors are used, for example, in level measuring devices, flow measuring devices, pressure and temperature measuring devices, pH redox potential measuring devices, conductivity measuring devices and the like. It records the corresponding process variables such as fill level, flow, pressure, temperature, pH value, redox potential and conductivity. Used to influence process variables are actuators, such as valves or pumps, via which the flow of liquid in a pipe, pipe, or line section or the level of fill in a container is changed. In general, all devices are referred to as field devices, which are applied near the proc...

Claims

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Application Information

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IPC IPC(8): H05K1/02G01F15/14H05K3/28H05K7/00
CPCH05K1/0268H05K3/284H05K2201/0133H05K2203/1316H05K2203/162H05K7/1462G01F15/00H01L2224/73265H01L2224/48091H01L2924/181H05K2203/1189H01L2924/00014H01L2924/00012H01L23/3135H01L23/49838
Inventor 贝恩德·施特鲁特克里斯蒂安·施特里马特西蒙·格尔维希托尔斯滕·西德勒拉尔夫·莱辛格
Owner EHNDRESS KHAUZER GMBKH KO KG