Portable chip sorting equipment with suction adjusting function

Abstract

The invention relates to portable chip sorting equipment with a suction adjusting function. The equipment comprises a vacuum pump, suction nozzles and straws, and further comprises a pressure regulating mechanism and a connecting mechanism. The connecting mechanism comprises a lifting sleeve and at least two reinforcing assemblies. Each reinforcing assembly comprises a transmission rod, a rotatingrod, a fixing rod and an elastic rope. The pressure regulating mechanism comprises a supporting rod, an air cylinder, a lifting rod, an isolation plate, two connecting assemblies, at least two vent holes and at least two sealing columns. The connecting assembly comprises a guide rail and a sliding block. In the portable chip sorting equipment with the suction adjusting function, the suction forceof the suction nozzle to the chips can be adjusted through the adjusting mechanism, the probability that the chips are damaged in the suction process is reduced, the practicability of the chip sorting equipment is improved, the suction nozzle dismounting and mounting convenience is improved through the connecting mechanism, meanwhile, the suction nozzle mounting firmness is improved, and the practicability of the chip sorting equipment is further improved.

Description

technical field [0001] The invention relates to the field of chip sorting equipment, in particular to a convenient chip sorting device with a suction adjustment function. Background technique [0002] The semiconductor chip is to cut wafers of different sizes into predetermined sizes. In order not to mess up the cut semiconductor chips during cutting, the wafer is bonded with an adhesive holding tape on the back side, and the wafer is cut from the front side by a wafer cutting device. , Although the holding tape bonded to the back is cut into a little, it is not cut, and it becomes the state of holding each semiconductor chip. Next, each cut semiconductor chip is picked up from the holding tape by a chip sorter. During the picking process, the chip is first Lift up from the wafer, and then absorb the surface of the chip through the suction nozzle to achieve peeling and transfer. [0003] When the chip sorting equipment in the prior art is in use, if the air pressure for suc...

AI Technical Summary

Problems solved by technology

[0003] When the chip sorting equipment in the prior art is in use, if the air pressure for sucking the chips is too high, the chips will be damaged; The chip sucks air, so it is necessary to adjust the air pressure accurately. Not only that, after a period of use, the suction nozzle of the chip sorting equipment will age and wear, so the efficiency of replacing the suction nozzle will affect the chip sorting efficiency. Work efficiency of picking equipment

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