A Target Point Calculation Method for Flying Probe Test

Abstract

The invention discloses a target point calculation method for flying probe testing, S1: load the light drawing file and obtain the design coordinates of the center point of the pad of the PCBA board; S2: according to the design coordinates of the center point of the pad of the PCBA board, Tie point type, device package type, calculate the target test point and its plane coordinates, calculate the difference between the plane coordinates of the target test point relative to the design coordinates of the PCBA board pad center point; S3: calculate the target test The deviation value of the point in height; S4: Combining with the deviation distribution of the target test point, perform distance compensation; S5: Obtain the three-dimensional coordinates of the final target test point. The present invention overcomes the problem of inaccurate probe-point testing in the prior art by adopting the technical means of compensating the difference between the target test point and the central point of the pad and compensating the height deviation to obtain the coordinates of the final target test point. problem, and achieved the goal of improving the accuracy of the probe piercing test component electrodes.

Description

technical field [0001] The invention relates to the technical field of automatic testing equipment, in particular to a target point calculation method for flying probe testing. Background technique [0002] Flying probe testing machine is an instrument for testing PCBA boards (printed circuit boards) with high density, many layers, high wiring density and small distance between measuring points. The work is connected to the driver through a multiplex transmission system. (signal generator, power supply, etc.) and sensors (digital multimeter, frequency counter, etc.) to test the components on the circuit board. [0003] With the development of semiconductor process technology, the density and complexity of electronic components on PCBA boards are increasing, and the size of mounted components is decreasing, which requires higher and higher requirements for probe stick test methods. [0004] In the prior art, the coordinates provided by the light-painting file are the design ...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the coordinates provided by the light-painting file are the design values ​​of the pad coordinates, but since the actual pricking point position is an electrode or solder, and there are processing errors, it is necessary to calculate the real target pin point, so the target pin point The accuracy is affected to a certain extent, which in turn affects the accuracy of the probe point

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