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A Method for Improving the Lamination Cavity of Mixed Press Plate

A technology of plate pressing and voiding, applied in the direction of multilayer circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of board scrapping, achieve the effect of solving scrapping, improving scrapping, and improving filling capacity

Active Publication Date: 2021-11-16
珠海崇达电路技术有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the board is scrapped due to the pressing void in the production of the existing mixed pressing board, and provides a method for improving the pressing void of the mixed pressing board, so as to reduce the scrapping rate of the board being scrapped due to the pressing void

Method used

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  • A Method for Improving the Lamination Cavity of Mixed Press Plate
  • A Method for Improving the Lamination Cavity of Mixed Press Plate
  • A Method for Improving the Lamination Cavity of Mixed Press Plate

Examples

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Effect test

Embodiment 1

[0020] This embodiment provides a method for preparing a mixed pressure board, especially a method for improving the pressure cavity of a mixed pressure board during the production of a mixed pressure board. The mixed laminated board of this embodiment is made of a pre-laminated structure formed by 2 eight-layer sub-boards and 3 inner-layer core boards, after lamination, outer-layer drilling and other post-processes. In the sub-board, the adhesive layer in the inner core board and the adhesive sheet for lamination are prepregs of model TU883; the adhesive layer in the other inner core board and the adhesive sheet used for lamination with the sub-board It is a prepreg of model TU865; the thickness of the finished board is 3.15±0.25mm, the minimum hole diameter of the sub-board is 0.175mm, and the minimum distance from the inner hole to the copper is 0.175mm.

[0021] Specifically include the following steps:

[0022] 1. Processing of inner core board

[0023] (1) Cutting: Cut...

Embodiment 2

[0051] This embodiment provides a method for preparing a mixed pressure board. The stacked structure of the mixed laminated board in this embodiment is consistent with that of the mixed laminated board in Example 1. The pre-laminated structure formed by 2 eight-layer sub-boards and 3 inner-layer core boards is laminated, outer-layer drilled, etc. Made in post process. In the sub-board, the adhesive layer in the inner core board and the adhesive sheet for lamination are prepregs of model TU883; the adhesive layer in the other inner core board and the adhesive sheet used for lamination with the sub-board It is a prepreg of model TU865; the thickness of the finished board is 3.15±0.25mm, the minimum hole diameter of the sub-board is 0.175mm, and the minimum distance from the inner hole to the copper is 0.175mm. The specific steps of preparing the mixed press board in this example are basically the same as those in Example 1, the difference lies in the control of temperature and ...

Embodiment 3

[0055] This embodiment provides a method for preparing a mixed pressure board. The stacked structure of the mixed laminated board in this embodiment is consistent with that of the mixed laminated board in Example 1. The pre-laminated structure formed by 2 eight-layer sub-boards and 3 inner-layer core boards is laminated, outer-layer drilled, etc. Made in post process. In the sub-board, the adhesive layer in the inner core board and the adhesive sheet for lamination are prepregs of model TU883; the adhesive layer in the other inner core board and the adhesive sheet used for lamination with the sub-board It is a prepreg of model TU865; the thickness of the finished board is 3.15±0.25mm, the minimum hole diameter of the sub-board is 0.175mm, and the minimum distance from the inner hole to the copper is 0.175mm. The specific steps of preparing the mixed press board in this example are basically the same as those in Example 1, the difference lies in the control of temperature and ...

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Abstract

The invention relates to the technical field of circuit board production and manufacturing, in particular to a method for improving the pressing void of a mixed pressure board. The present invention improves the filling capacity of the prepreg during the pressing process by adjusting and optimizing the pressing temperature and pressing pressure at each stage in the pressing process, especially in combination with a certain rate of temperature rise and fall and pressure rise and fall rate, and overcomes the pressure generated during the pressing process. A small amount of gas and the void problem caused by the fluidity of the prepreg, thereby improving and solving the problem of scrapping caused by pressing voids in the production of mixed press boards.

Description

technical field [0001] The invention relates to the technical field of circuit board production and manufacturing, in particular to a method for improving the pressing void of a mixed pressure board. Background technique [0002] Lamination is a necessary process in the production of multilayer printed circuit boards. Lamination refers to the bonding of the inner core board with the outer copper foil / outer core board through high temperature, high pressure and prepreg adhesive sheets to form a whole. Form a multilayer sheet. Then continue to make the outer layer circuit on the multilayer board and make via holes between the corresponding circuit layers according to the conduction requirements, such as metallized blind holes, buried holes and through holes. The quality of lamination is extremely important for the stability between the various circuit layers in the product, especially for products with many circuit layers. The mixed laminated board refers to a multi-layer ci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611
Inventor 孙保玉彭卫红周文涛罗练军
Owner 珠海崇达电路技术有限公司
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