Embedded sphere die composite abrasive particle grinding and polishing silicon micro-concave die array method

Abstract

The invention discloses an embedded sphere die composite abrasive particle grinding and polishing silicon micro-concave die array method. The method comprises the following steps that a grinding and polishing die is manufactured, wherein the grinding and polishing die comprises tool connecting rods, laser ranging sensors and sphere bodies, array holes are formed in the end face of the lower end ofa tool head, and the diameter of a single concave die is equal to the diameter of the sphere bodies; one half of each sphere body is embedded into the corresponding hole, and a layer of uniform waterproof adhesive is arranged between each aperture and the corresponding sphere body; andthe part between the grinding and polishing die and the surface of a workpiece is filled with grinding and polishing liquid, abrasive particles in the grinding and polishing liquid are composite abrasive particles, the grinding and polishing die is used for carrying out high-frequency micro-ultrasonic vibrationon the upper surface of the workpiece, and a half of the sphere bodywhich isexposed outside the tool head are stimulated by the ultrasonic vibration to impact the surface of the workpiece together with the abrasive particles to form micro-hemispherical pits matched with the sizes of the sphere bodies. According to the method, through the vibration of the micro-ultrasonic grinding and polishing die, high-frequency impact of the sphere bodies and the nanoscale abrasive particles in the grinding and polishing liquid on the surface of the silicon workpiece is stimulated so as to removal materials.The machining efficiency of a micro-hemispherical concave die array is greatly improved, and the shape consistency of the concave dies is guaranteed.

Description

technical field [0001] The invention relates to the field of ultra-precision machining, in particular to a method for lapping and polishing silicon micro-concave mold arrays with embedded spherical mold composite abrasive grains. Background technique [0002] Hemispherical resonant gyroscope is a new type of inertial sensor, which has the characteristics of high precision, strong stability, high reliability and long life, and has good resistance to shock and vibration and good temperature performance. It has been used in aviation, weapons and other fields began to be used. However, the processing accuracy of the spherical shell of this gyroscope is low, the main reason is that the processing accuracy of the parent body—the hemispherical die array is poor. The die material has high hardness, small size and difficult processing. There are existing processing methods for the die, such as micro-cutting, micro-ultrasonic layered machining, and micro-electric discharge machining...

AI Technical Summary

Problems solved by technology

The main reasons are: (1) When the micro-hemispherical concave die is processed by micro-cutting, the bottom or top of the micro-hemisphere will crack and the surface and sub-surface will be damaged during the process of material brittle removal, which cannot meet the requirements of machining accuracy.

Processing efficiency and yield cannot be guaranteed

(2) Micro-ultrasonic layered machining, because the micro-tools will wear, and the wear cannot be predicted and controlled, so it is difficult to plan the layered feed path, resulting in poor shape accuracy of the micro-hemisphere and low processing efficiency

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