An electronic component and its pins

Abstract

An electronic part and its pins. The invention discloses a lead, comprising: A zone and B zone, the inner edge of the A zone is connected with the B zone; the A zone is provided with a hole through the top surface and the bottom surface, and the A zone The outer edge is provided with notched hollows, and / or, the outer edge of the A area is provided with a slope inclined towards the bottom surface; the bottom surface of the B area is provided with a groove and / or a protrusion. By providing through holes in the A region, the outer edge of the A region is provided with a bevel, and / or the bottom surface of the B region is provided with a channel, which greatly increases the soldering contact area of ​​the pins and improves the lead. welding reliability. In addition, the bottom surface of the B area is provided with protrusions to enhance the roughness of the bottom surface, prevent welding drift, and also reduce the risk of solder paste splashing. The present invention also provides an electronic component, comprising a component body and pins, the pins are the pins as described above, and the top surface of the region B of the pins is assembled on the component body.

Description

technical field [0001] The invention relates to the technical field of welding of electronic parts, in particular to an electronic part and its pins. Background technique [0002] With the increase in the types of personal electronic consumer goods and the development of various data clouds, the application range of servers and personal electronic consumer goods is becoming wider and wider. As a result, the number of applications of electronic components in the electronics industry is increasing, among which there are more and more high-power electronic components, and high-power electronic components have a characteristic that they need to pass through a large current, so they generally have a large area pins in order to improve the tolerance of the parts. [0003] However, in actual production, such large-area pins have many soldering problems. Due to the huge area, if there is too little solder paste during production, the pins will not be soldered to the PCB; If there ...

AI Technical Summary

Problems solved by technology

[0003] However, in actual production, such large-area pins have many soldering problems. Due to the huge area, if there is too little solder paste during production, the pins will not be soldered to the PCB; If there are too many, it will cause the problem of part drift and excess solder paste forming tin beads and splashing everywhere; in addition, due to the huge pin area, the heat dissipation effect is better. When soldering, the soldering will not be strong enough due to insufficient heat. As a result, the parts cannot reach the applied current value, causing the product to malfunction

Images