Crushing equipment based on irregular semiconductor materials

Abstract

The invention relates to the technical field of semiconductor processing, and discloses crushing equipment based on irregular semiconductor materials. The crushing equipment comprises a machine body,wherein a first crushing box and a second crushing box are arranged inside the machine body, the side surface of the first crushing box is fixedly connected with the inner wall of the machine body, the side surface of the second crushing box is fixedly connected with the inner wall of the machine body, and the second crushing box is positioned above the first crushing box. According to the crushing equipment based on the irregular semiconductor materials, a material collecting box is positioned inside a cavity, after crushing is completed through a device, a shifting block is pulled upwards, so that a limiting rod moves upwards to drive a baffle to move upwards, the bottom end of the limiting rod is separated from the interior of a limiting ring, a side door is opened after separation, andthe a telescopic rod can push a pushing plate to move towards the right side, so that the bottom of the collecting box rolls towards the right side inside a sliding rail through a pulley, and the material collecting box can be conveniently taken out from the interior of the device, so that the effect of convenient material taking is achieved when the device is used.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a crushing device based on irregular semiconductor materials. Background technique [0002] Semiconductor material is a substance whose conductivity is between that of a conductor and an insulator. It is a type of electronic material that has semiconductor properties and can be used to make semiconductor devices and integrated electronics. Common semiconductor materials include silicon, germanium, and gallium arsenide. Among them, Silicon is one of the most influential in commercial applications among various semiconductor materials. Many of these semiconductor materials exist in irregular forms. During processing, these materials need to be broken, and In the crushing process, special crushing equipment is required. [0003] When processing these irregular semiconductor materials, it is necessary to break the lumped material into small pieces first, and then us...

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Problems solved by technology

[0003] When processing these irregular semiconductor materials, it is necessary to break the lumped materials into small pieces first, and then use the crushing device to crush them into uniform-sized particles. The existing crushing device mainly consists of a bottom plate, a frame, a crushing box, The crushing box and the crushing roller are structured. During use, the body controls the crushing box and the fine crushing box to crush the materials inside the device respectively. However, after the crushing of these devices is completed, the materials are stored inside the body and need to be crushed at the discharge port. The crushed material is collected by canning, etc., which makes it more troublesome for the device to collect the crushed material. Then, during the working process of the device, the main part of the body is mainly driven by the motor, so that the device is in use. There will be a certain vibration in the device. The device is in a vibrating environment for a long time when it is working, which will cause some parts inside the device to loosen, which is likely to cause safety hazards. At the same time, strong vibration will also have a certain impact on the surrounding environment. To this end we propose a crushing device based on irregular semiconductor materials

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