Piezoelectric MEMS vector vibration sensor sensitive body

A vibration sensor and sensitive body technology, applied in the direction of instruments, measuring devices, electrical devices, etc., can solve the problems of inability to achieve accurate orientation, low orientation accuracy, poor reliability of a single vector vibration sensor, etc., and achieve low power consumption, orientation High precision and good reliability

Inactive Publication Date: 2019-10-29
SHANXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the object of the present invention is to provide a sensitive body of a piezoelectric MEMS vector vibration sensor, which can realize high-precision orientation in the range of 360°, and aims to overcome the poor reliability, low orientation accuracy and inability of the existing single vector vibration sensor. Accurate orientation in 360° range and other issues

Method used

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  • Piezoelectric MEMS vector vibration sensor sensitive body
  • Piezoelectric MEMS vector vibration sensor sensitive body
  • Piezoelectric MEMS vector vibration sensor sensitive body

Examples

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Embodiment

[0025] Such as Figure 1-3 As shown, a piezoelectric MEMS vector vibration sensor sensitive body includes a square silicon substrate 1, and eight circular grooves with exactly the same structural size are evenly etched on the circumference of the square silicon substrate 1 as the center of the circle. 11. A circular thin film layer 12 is formed on the end surface of the square silicon substrate 1 corresponding to each circular groove 11;

[0026] The piezoelectric sensitive unit 2 is arranged on the circular thin film layer 12, and the piezoelectric sensitive unit 2 includes a lower electrode layer 21, a piezoelectric thin film layer 22 and an upper electrode layer 23, and the piezoelectric thin film layer 22 is arranged on the lower electrode layer. Between layer 21 and upper electrode layer 23;

[0027] The piezoelectric sensitive unit 2 is provided with a power transmission unit 3, and the piezoelectric sensitive unit 2 can convert the stress and strain signal received by ...

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Abstract

The invention discloses a piezoelectric MEMS vector vibration sensor sensitive body, which comprises a square silicon substrate; eight circular grooves with the same structure size are uniformly etched at intervals on the circumference taking the center of the square silicon substrate as a circle center, and circular thin film layers are formed on parts, corresponding to the circular grooves, of an end surface of the square silicon substrate; piezoelectric sensitive units and force transmission units composed of composite elastic beams and stand columns are sequentially arranged on the circular thin film layers, cantilever beams forming the composite elastic beams correspond to the piezoelectric sensitive units one to one, the piezoelectric sensitive units convert stress-strain signals received by the force transmission units into electric signals, and signal detection is achieved. Vibration source orientation estimation is realized by utilizing different polarization forms of the eight piezoelectric films in the mutually perpendicular directions, port and starboard fuzziness is eliminated, two independent coordinate systems with strictly coincident coordinate origins are constructed on one micro-sensitive structure unit, orientation estimation is performed by utilizing the two coordinate systems, and the orientation precision and the reliability are high.

Description

technical field [0001] The invention relates to the field of MEMS vibration sensors, in particular to a sensitive body of a piezoelectric MEMS vector vibration sensor. Background technique [0002] Vibration sensors are used in biological, chemical and medical analysis, in aerospace, aviation, navigation inertial navigation systems and guidance systems for carrying weapons, in vibration tests, earthquake monitoring, blasting engineering, large bridges, foundation surveys, geological and mine surveys, aircraft It has a wide range of applications in measurement fields such as automotive NVH. With the continuous development of semiconductor technology and MEMS technology, vibration sensors are gradually developing in the direction of miniaturization, intelligence, and integration. Vibration sensors based on MEMS technology have broad application prospects in military and civilian fields. A single vibration sensor developed using MEMS technology can already perform target orien...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01H11/08
CPCG01H11/08
Inventor 刘林仙高佳
Owner SHANXI UNIV
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