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Semiconductor package structure

A packaging structure and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems that are difficult to significantly improve the reliability and service life of power modules, so as to avoid electromigration effects, Uniform distribution, improving reliability and service life

Active Publication Date: 2019-11-01
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, it is difficult to significantly improve the reliability and service life of the power module with the existing design of the conductive buckle

Method used

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  • Semiconductor package structure
  • Semiconductor package structure
  • Semiconductor package structure

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Experimental program
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Embodiment Construction

[0057] figure 1 is a schematic diagram of the semiconductor package structure of the first embodiment of the present invention. Please refer to figure 1 , in this embodiment, the semiconductor package structure 100 can be a power module, which can be applied to devices such as motor drivers, frequency converters, converters or power supplies, and involves renewable energy power generation, non-renewable energy power generation, temperature control equipment or In the field of electric vehicles, for example, the power module can be a high-power module, a medium-power module or a low-power module, but the present invention does not limit the type and application of the semiconductor package structure.

[0058] Specifically, the semiconductor package structure 100 includes a first conductor 110, a first bonding layer 120, a first conductive sheet 130, and a second conductive sheet 140, wherein the first conductor 110 may include a conductive carrier 111 (such as a circuit board ...

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Abstract

A semiconductor package structure includes a first conductor, a first bonding layer, a first conductive sheet, and a second conductive sheet. The first bonding layer is arranged on the first conductor. The first conductive sheet comprises a first joint part and a first extension part which are connected with each other. The first bonding portion is bonded to the first bonding layer, the first conductive sheet has a first trench, and the first trench divides the first bonding portion into two parallel first bonding branches. The second conductive sheet comprises a second joint part and a secondextension part which are connected with each other. The second bonding portion is bonded to the first bonding layer, the second conductive sheet has a second trench, and the second trench divides thesecond bonding portion into two parallel second bonding branches. The second extension part is parallel to the first extension part, the second joint part is opposite to the first joint part, and thesecond extension part is located between the first extension part and the second joint part.

Description

technical field [0001] The invention relates to a semiconductor packaging structure. Background technique [0002] A common power module is a power chip carried by a conductive carrier (such as a circuit board or a lead frame), and the power chip can be electrically connected to other electronic components or electrical contacts of the conductive carrier by using a wire, or electrically connected to other electronic components by using a conductive buckle Or the electrical contact of the conductive carrier. As far as the implementation of using wires to electrically connect the electrical contacts of the power chip and other electronic components or conductive carriers, to meet the operating requirements of large currents, the number of wires needs to be increased correspondingly to share the current and avoid overheating of the wires And blown. Furthermore, this approach is difficult to improve the efficiency of the manufacturing process, and the heat dissipation effect i...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L23/52
CPCH01L21/4814H01L21/4871H01L23/52H01L2224/40
Inventor 韩伟国张景尧徐世丰
Owner IND TECH RES INST
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