Solar cell electrode paste printing device and electrode preparation system
A technology for solar cells and electrode pastes, which is applied in printing, circuits, typewriters, etc., and can solve the problems of solar cell performance degradation and waste of raw materials
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Embodiment 1
[0049] The preparation steps of a solar cell electrode are as follows:
[0050] Take the P-type silicon wafer containing various functional layers and put it on the conveyor belt, and then transfer it to the workbench through the conveyor belt. After that, the CCD light source positioning system collects the area to be etched on the silicon wafer, and the coaxial XYZ controller acquires the area to be etched on the silicon wafer. After the position data of the etching area is obtained, the movement of the gun body mounting frame is adjusted to realize the alignment between the laser etching gun and the area to be etched of the P-type silicon wafer.
[0051] Then move the laser etching gun to etch groove lines on the area to be etched on the P-type silicon wafer. The parameters of the laser etching are set as follows: the laser wavelength is 532nm, and the spot diameter of the laser mold opening is adjusted to 20μm. With the movement of the laser etching gun, the inkjet gun mov...
Embodiment 2
[0054] The preparation steps of a solar cell electrode are as follows:
[0055] Take the P-type silicon wafer containing various functional layers and put it on the conveyor belt, and then transfer it to the workbench through the conveyor belt. After that, the CCD light source positioning system collects the area to be etched on the silicon wafer, and the coaxial XYZ controller acquires the area to be etched on the silicon wafer. After the position data of the etching area is obtained, the movement of the gun body mounting frame is adjusted to achieve alignment between the laser etching gun and the area to be etched on the P-type silicon wafer.
[0056] Then move the laser etching gun to etch groove lines on the area to be etched on the P-type silicon wafer. The parameters of the laser etching are set as follows: the laser wavelength is 532nm, and the spot diameter of the laser mold opening is adjusted to 200μm. With the movement of the laser etching gun, the ink jet of the in...
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