Carrier plate conveying line device of integrated circuit film removing machine

Abstract

The invention relates to the technical field of electronic integrated circuit manufacturing, and discloses a carrier plate conveying line device of an integrated circuit film removing machine. The carrier plate conveying line device comprises conveying frames, a direct current motor, a conveying belt, heating plates, driving friction wheels, a stepping motor, a pressing wheel assembly, a receivingplate assembly, an empty plate collecting assembly and a prepressing wheel assembly; the conveying frames are arranged on a frame; feeding ends of the conveying frames are provided with the driving friction wheels; the driving friction wheels are driven by the stepping motor; the prepressing wheel assembly is arranged above the driving friction wheels; the prepressing wheel assembly presses a roller towards the driving friction wheels through elasticity of springs; the heating plates are arranged at the ends of the two conveying frames; the pressing wheel assembly is arranged above the heating plates and comprises a pressing cylinder, a roller mounting plate and a plurality of rollers; the rollers are connected to a telescopic end of the pressing cylinder through a roller mounting plate;the rollers correspond to the edge frame strip of a carrier plate; and the rear end of each heating plate is provided with a limiting assembly. The carrier plate conveying line device is capable of automatically feeding and discharging, high in adaptability, reliable in conveying and accurate in positioning.

Description

technical field [0001] The invention relates to the technical field of electronic integrated circuit manufacturing, in particular to a carrier conveying line device of an integrated circuit film tearing machine. Background technique [0002] With the development of society, semiconductor devices and their packaging are becoming thinner and miniaturized. In some cases, the back of the integrated circuit needs to be protected by a protective film to prevent damage to the integrated circuit chip. When packaging, the protective film should be peeled off. In the existing integrated circuit production process, because the bottom film is bonded to the chip through an adhesive, the existing film tearing equipment cannot effectively reduce the viscosity of the bottom film, resulting in low tearing efficiency and easy damage to the backside of the integrated circuit. metal damage. [0003] The State Intellectual Property Office published the publication number CN207068801U on 2018.0...

AI Technical Summary

Problems solved by technology

This patent can only separate one chip at a time, which is inefficient, and the chips taken out are not collected

[0004] To sum up, the existing integrated circuit film tearing operation has the problems of low automation of loading and unloading, continuous processing, cumbersome glue tearing process, and inability to complete the collection of integrated circuits

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