Integrated circuit, film removing method of integrated circuit and film removal arranging device of integrated circuit

Abstract

The invention relates to the technical field of integrated circuit manufacturing, and discloses a film removal arranging device of an integrated circuit. The film removal arranging device comprises aframe, two symmetrically arranged carrier plate feeding devices, two symmetrically arranged carrier plate conveying line devices, two symmetrically arranged film removing devices, a carrying manipulator, a visual detection device, a tray feeding device and a tray conveying line device, wherein the carrier plate feeding devices, the carrier plate conveying line devices, the film removing devices, the carrying manipulator, the visual detection device, the tray feeding device and the tray conveying line device are arranged on the frame; the film removing devices are positioned below the carrier plate feeding devices; the carrier plate conveying line devices are connected with the carrier plate feeding devices; the tray feeding device is positioned between the two carrier plate feeding devices; the tray conveying line device is positioned between the two carrier plate conveying line devices and is connected with the tray feeding device; and the carrying manipulator and the visual detectiondevice are arranged on the frame and are positioned above the carrier plate conveying line devices and the tray conveying line device. The film removal arranging device has the advantages of being efficient and accurate in glue removing, automatic in feeding and discharging, high in processing efficiency and capable of collecting and arranging the integrated circuit.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to an integrated circuit tear film typesetting device and working method. Background technique [0002] With the development of society, semiconductor devices and their packaging are becoming thinner and miniaturized. In some cases, the back of the integrated circuit needs to be protected by a protective film to prevent damage to the integrated circuit chip. When packaging, the protective film should be peeled off. In the existing integrated circuit production process, because the bottom film is bonded to the chip through an adhesive, the existing film tearing equipment cannot effectively reduce the viscosity of the bottom film, resulting in low tearing efficiency and easy damage to the backside of the integrated circuit. metal damage. [0003] The State Intellectual Property Office published the publication number CN207068801U on 2018.03.02, and the paten...

AI Technical Summary

Problems solved by technology

This patent can only separate one chip at a time, which is inefficient, and the chips taken out are not collected

[0004] To sum up, the existing integrated circuit film tearing operation has the problems of low automation of loading and unloading, continuous processing, cumbersome glue tearing process, and inability to complete the collection of integrated circuits

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