Class 2 solid-state relay with split-level structure

A kind of solid state and relay technology, applied in relays, electromagnetic relays, detailed information of electromagnetic relays, etc., can solve problems such as unreasonable double-layer structure design, achieve miniaturization design, avoid electrical interference, and solve the effect of reducing bonding force

Pending Publication Date: 2019-11-08
G & A TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] What the present invention aims to solve is the unreasonable problem of the double-layer structure design of the existing solid state relay, and provides a kind of 2 types of solid state relays with a split layer structure

Method used

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  • Class 2 solid-state relay with split-level structure
  • Class 2 solid-state relay with split-level structure
  • Class 2 solid-state relay with split-level structure

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific examples. It should be noted that the directional terms mentioned in the examples, such as "upper", "lower", "middle", "left", "right", "front", "rear", etc., are only referring to the directions of the drawings. Therefore, the directions used are only for illustration and are not intended to limit the protection scope of the present invention.

[0024] see Figure 1-2 , a type 2 solid relay with a split-layer structure, mainly composed of a relay circuit, an upper printed circuit board 5 , a lower heat dissipation bottom plate 6 , a ceramic substrate 7 , a flow guide post 8 and four lead-out rods 9 . The circuit principle structure of the relay circuit is the same as that of the prior art, mainly composed of a pre-input thick-film circuit 1, a magnetic isolator 2, a post-input thic...

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Abstract

The invention discloses a class 2 solid-state relay with a split-level structure. The class 2 solid-state relay comprises an upper-layer printed board, a lower-layer heat dissipation bottom board, a ceramic substrate, a flow guide column, four lead-out rods, an input control circuit and an output power circuit; the input control circuit comprises an input preceding-stage thick film circuit, a magnetic isolator and an input backward-stage thick film circuit. Through reasonable optimization design of distribution of the solid-state relays, the input preceding-stage thick-film circuit and the input backward-stage thick-film circuit are arranged on the front side and the back side of the upper-layer printed board respectively, so that the two thick-film circuit boards form physical isolation;meanwhile, the input control circuit is arranged on the upper-layer printed board, the output power circuit is arranged on the lower-layer heat dissipation bottom board, and the input control circuitelectrically controls the output power circuit through the flow guide column, so that effective isolation is formed, and the electrical interference phenomenon is avoided.

Description

technical field [0001] The invention relates to the technical field of solid relays, in particular to a Class 2 solid relay with a split-layer structure. Background technique [0002] With the development of the electronic industry, the integration requirements of solid state relays are getting higher and higher. In order to meet the requirements of miniaturization, more and more solid state relays adopt Class 2 double-layer structure. However, the current two types of solid-state relays with a double-layer structure have the following shortcomings: First, the distribution and design of each circuit function component in the upper and lower layers is unreasonable, so that interference between different layers is prone to occur, and the space utilization rate is not high. It is difficult to meet the miniaturization requirements of the device; secondly, only the insulation resistance performance requirements are considered between the input circuit functional components and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H50/12H01H50/04
CPCH01H50/043H01H50/12
Inventor 郭竟李富成谢林波任海峰海翔宁艳艳
Owner G & A TECH
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