Servo adjustable pendulum impact tester

Abstract

The invention belongs to the technical field of electronic testing devices, in particular to a servo adjustable pendulum impact tester. The servo adjustable pendulum impact tester comprises a rack assembly, a feeding mechanism, a clamp assembly and a pendulum clock mechanism, wherein the rack assembly comprises a bottom plate; a machine frame is fixedly arranged at the top of the bottom plate; thefeeding mechanism is fixed on the bottom plate and is used for driving a chip to move in the machine frame; the clamp assembly is fixed on the feeding mechanism and is used for fixing a to-be-testedchip; and the pendulum clock mechanism is fixed on the bottom plate. According to the servo adjustable pendulum impact tester, the to-be-tested chip is fixed by using the clamp assembly, and then theclamp assembly is driven to move in the machine frame by adopting the feeding mechanism, so that loading and unloading operations of an operator are facilitated; and the chip on the clamp assembly issubjected to impact test by using the pendulum clock mechanism and the impact test process is shot and recorded through a shooting mechanism, so that the servo adjustable pendulum impact tester has the advantages of high test efficiency and an accurate test result when strength impact test is carried out on the chip by adopting the servo adjustable pendulum impact tester.

Description

technical field [0001] The invention relates to the technical field of electronic testing devices, in particular to a servo-adjustable pendulum impact testing machine. Background technique [0002] After the chip production is completed, in order to ensure that the chip and other electronic components are assembled into an electronic product, the electronic product is not easily damaged after being impacted, and the impact performance of the finished chip needs to be tested. At present, the main impact tests are thermal shock test and strength Impact test, including hot and cold shock test and the most complete testing equipment, force impact test mainly tests the bonding strength between CG and the sensor bonded on CG, but the current force impact test equipment is poor, on the one hand, the test efficiency is low , unable to meet the needs of the actual test, on the one hand, the test effect is not ideal, resulting in inaccurate test results, because the present invention ...

AI Technical Summary

Problems solved by technology

[0002] After the chip production is completed, in order to ensure that the chip and other electronic components are assembled into an electronic product, the electronic product is not easily damaged after being impacted, and the impact performance of the finished chip needs to be tested. At present, the main impact tests are thermal shock test and strength Impact test, including hot and cold shock test and the most complete testing equipment, force impact test mainly tests the bonding strength between CG and the sensor bonded on CG, but the current force impact test equipment is poor, on the one hand, the test efficiency is low , unable to meet the needs of actual testing. On the one hand, the effect of the test is not ideal, resulting in inaccurate test results, because the present invention proposes to adopt a certain mechanical structure and scientific technology to design a chip with high test efficiency and accurate test results. Strength impact test device

Images