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Method for manufacturing resin plug hole in PCB

A technology of resin plugging and resin ink, which is applied in the manufacture of printed circuits, the formation of electrical connections of printed components, electrical components, etc., can solve the problems of plug holes not full and bubbles in the holes, so as to reduce the problem of plug holes being not full and good Fullness, the effect of eliminating air bubbles

Inactive Publication Date: 2019-11-12
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the plug hole is not full and bubbles exist in the existing resin plug hole manufacturing process, and provides a method of solving the plug hole by changing the silk screen printing method of the resin ink and optimizing the process parameters of the screen printing resin ink. The method of making resin plugged holes without fullness and bubbles in the holes

Method used

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Embodiment

[0023] This embodiment provides a method for making a resin plug hole on a PCB, which specifically includes the following steps:

[0024] (1) Cutting: Cut out the double-sided copper clad laminate as the inner core board according to the panel size required by the design.

[0025] (2) Making the inner layer circuit: adopt the negative film process to make the inner layer circuit on the inner layer core board. Carry out OPE punching and inner layer AOI sequentially according to conventional procedures.

[0026] (3) Lamination: After the inner core board is pre-pressed, the inner core board, prepreg, and outer copper foil are pre-stacked together according to the product design, and are welded and / or riveted. Pre-fixing, each layer is pre-fixed together to form a pre-laminated structure, and then the pre-laminated structure is pressed together to form a multi-layer production board with a thickness of 2mm.

[0027] (4) Outer layer drilling: Drill holes on the production board ...

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Abstract

The invention relates to the technical field of circuit board production and manufacturing, in particular to a method for manufacturing a resin plug hole in a PCB. According to the invention, silk screen printing of resin ink is performed on the bottom surface and the front side of a production board twice; the resin ink with viscosity of 450-640 dpa.s is screen-printed at a speed of 15-20 mm / s and 30-35 mm / s under a vacuum degree of 40-80 Pa; the fullness of the resin ink in the front hole at the time of the silk screen printing of the first time is controlled of be 60%-70%; and three-stage plate baking treatment is carried out according to the temperature and the time, so that the problem of occurring of bubbles in the resin plug hole can be avoided, and the problem that the plug hole isnot full can be effectively reduced, thereby solving the problems that the resin plug holes of the existing resin plug hole plate are uneven in copper plating or cannot be plated with copper, and plate explosion occurs when a production plate passes through a tin furnace. The silk-screen effect can be further guaranteed by simultaneously controlling the parameters such as the scraper thickness, the scraper angle and the scraper speed, the fullness of the resin ink in the front hole is better controlled, and tiny bubbles contained in the resin ink in the front hole are reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board production and manufacturing, in particular to a method for making resin plug holes on a PCB. Background technique [0002] In the production of PCB, it is a common practice to make resin plug holes on the PCB. This type of PCB with resin plug holes is called a resin plug hole plate. Process, drilling, copper sinking, full plate plating, plug hole, baking plate, grinding plate, outer circuit and other post-processes. If the process of making the resin plugged hole plate is not well controlled, there will often be bad problems such as the plug hole is not full or there are air bubbles in the hole. The plug hole is not full, which will lead to uneven copper plating on the resin plug hole or failure Copper, the air bubbles in the holes will cause the board to explode when the production board passes through the tin furnace due to the moisture absorption of the air bubbles. The current manufac...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0094H05K3/42H05K2201/0959H05K2203/1178
Inventor 刘琪刘丽娟黄宗江宋建远
Owner SHENZHEN SUNTAK MULTILAYER PCB
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