Two-step optimization design method for reliability of system-in-package micro-bump structure

Abstract

The invention discloses a two-step optimization design method for reliability of a system-in-package micro-bump structure, and belongs to the technical field of system-in-package. The method is characterized by comprising the following steps: 1, establishing an orthogonal test design combination by establishing a system-in-package structure model and determining material factors and levels influencing the reliability of micro-bumps, analyzing by taking the thermal stress of the micro-bumps as response, and obtaining a material factor optimization combination by utilizing a Taguchi method; and2, determining structural factors and ranges influencing the reliability of the micro-bumps, establishing a test design combination through a central composite method, and performing parameter optimization selection according to the structural factors to finish the structural parameter optimization of the reliability of the system-in-package micro-bumps. According to the two-step method, the micro-bump reliability problem is researched from the system-in-package micro-bump structure and the overall environment where the system-in-package micro-bump structure is located, the relation between the system-in-package overall structure and the micro-bump reliability is considered, the purpose of improving the micro-bump reliability is achieved, the reliability of system-in-package is effectivelyimproved, and the research and development period is shortened.

Description

technical field [0001] The invention belongs to the technical field of system-level packaging, and in particular relates to a two-step optimization design method for the reliability of micro-bump structures of system-level packaging. Background technique [0002] The reliability of system-in-package is the primary challenge for the development of system-in-package technology, and the reliability of micro-bumps is one of the important research directions. The reliability of micro-bumps is not only related to the structural parameters and materials of micro-bumps, but also related to their location, and the service environments of different locations are also inconsistent. In the actual process flow, the service environment and position of micro-bumps will also have a great impact on the reliability of micro-bumps. Under the action of temperature cycles, due to the inconsistent thermal expansion coefficients of micro-bumps and other structures, internal Thermal stress and the...

AI Technical Summary

Problems solved by technology

[0003]There is currently no unified process standard for the analysis of the reliability of system-in-package, and there are few studies on the reliability of micro-bumps in key structures

However, the existing micro-bump reliability optimization methods mainly start from the perspective of the micro-bump itself, only considering the attribute parameters of the micro-bump, but ignoring the influence of other structural factors on the reliability of the micro-bump, which may lead to Factors optimized for micro-bumps are incomplete and the optimal results cannot be obtained

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