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I3C interface circuit compatible with SRAM bus

A technology of interface circuit and bus, which is applied in the field of I3C interface circuit, can solve the problems of complex connection between communication controller and host system, affecting I3C communication efficiency, etc.

Active Publication Date: 2019-11-22
GOWIN SEMICON CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides an I3C interface circuit compatible with the SRAM bus to solve the problem that the connection between the communication controller and the host system is complicated and affects the efficiency of I3C communication

Method used

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  • I3C interface circuit compatible with SRAM bus
  • I3C interface circuit compatible with SRAM bus
  • I3C interface circuit compatible with SRAM bus

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0031] figure 1 A schematic diagram of an I3C interface circuit compatible with an SRAM bus in an embodiment of the present embodiment is shown. like figure 1As shown, the I3C interface circuit compatible with the SRAM bus is set between the I3C communication controller and the SRAM bus, and is used to package the custom interface of the I3C communication controller into an SRAM bus interface, so as to facilitate the connection of the I3C communicatio...

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Abstract

The invention discloses an I3C interface circuit compatible with an SRAM bus. The I3C interface circuit comprises an operation layer circuit connected with an I3C communication controller, composed ofN configuration registers which are connected with the I3C communication controller and used for realizing a custom function, wherein each configuration register corresponds to a register interface and is used for communicating with the I3C communication controller; and a bus packaging layer circuit connected with the N configuration registers on the operation layer circuit, connected with an SRAM bus, and used for packaging register interfaces corresponding to the configuration registers into SRAM bus interfaces so as to realize communication with the SRAM bus. According to the I3C interfacecircuit, a register interface corresponding to a configuration register connected with an I3C communication controller can be packaged into an SRAM bus interface. The I3C communication controller isconnected with the SRAM bus, so that the connection with the SRAM bus is realized. The connection line of the I3C communication controller and a host system is simplified. A universal and flexible busconnection mode is provided, so that the I3C bus equipment has wider compatibility.

Description

technical field [0001] The invention relates to the technical field of integrated circuit IP core design, in particular to an I3C interface circuit compatible with an SRAM bus. Background technique [0002] The full name of IP core is intellectual property core (Intellectual Property Core), which refers to a chip design module provided by a certain party. Designers can use the IP core as the basis for logic design of ASIC or Field Programmable Logic Gate Array (FPGA) to shorten the design cycle and improve design quality and efficiency. [0003] With the rapid development of technologies such as 4G / 5G and the Internet of Things, sensors, as the entrance of data information collection and the "heart" of the Internet of Things, have received more and more attention. The I2C bus is widely used because of its simplicity, low resource consumption, multiple slaves, and low power consumption. However, with the development trend of smart and miniaturized sensors, the limitations of...

Claims

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Application Information

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IPC IPC(8): G06F13/16G06F13/40G06F13/42G11C11/413
CPCG06F13/1684G06F13/1694G06F13/4068G06F13/4282G11C11/413
Inventor 周成龙杜辉赵方亮闫冬韩志伟
Owner GOWIN SEMICON CORP LTD