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Method for driving member and processing apparatus

A driving method and component technology, applied in the direction of measuring devices, optical devices, electrical components, etc., can solve the problem of difficult control of etching characteristics such as wafer etching rate, and achieve the effect of accurate driving

Pending Publication Date: 2019-11-22
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, when the height of the edge ring changes due to consumption, the height of the sheath on the edge ring changes, and it is difficult to control the etching characteristics such as the etching rate of the edge portion of the wafer.

Method used

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  • Method for driving member and processing apparatus
  • Method for driving member and processing apparatus
  • Method for driving member and processing apparatus

Examples

Experimental program
Comparison scheme
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Deformed example 2

[0140] figure 2 The illustrated lift pins 102 are provided in plurality, and their up and down movements can be independently controlled using the movement mechanism 200 . Therefore, an example will be described in which the lift pins 102 of the edge ring 87 are independently driven at each location to individually adjust the height of the edge ring 87 at each location as the edge ring drive process of Modification 2 of the above-mentioned embodiment. , thereby correcting the misalignment of the wafer W.

[0141] Figure 7 It is a graph showing an example of the etching characteristics of the edge portion of the wafer W when there is no deviation in the arrangement of the wafer W according to one embodiment. Figure 8 It is a graph showing an example of the etching characteristics of the edge portion of the wafer W when the arrangement of the wafer W is deviated according to one embodiment. Figure 9 It is a diagram showing an example of the displacement of the arrangement...

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PUM

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Abstract

There is provided a method for driving a member provided in a processing chamber. The method includes irradiating to the member measurement light having a wavelength that penetrates the member, detecting intensity distribution of reflected light based on reflected light from an upper surface of the member and reflected light from a bottom surface of the member, calculating an optical path difference by applying Fourier transform to a spectrum indicating the intensity distribution, and determining a driving amount of the member based on the optical path difference. The method further includes driving the member based on the determined driving amount.

Description

technical field [0001] The present invention relates to a driving method and a processing device for components. Background technique [0002] In a plasma processing apparatus, an edge ring is provided along the outer periphery of a wafer (for example, refer to Patent Document 1). The edge ring has a function of controlling the plasma near the outer periphery of the wafer to improve the uniformity of the etching rate in the wafer. [0003] The etch rate of the wafer, mainly at the edge, varies depending on the sheath on the edge ring. Therefore, when the height of the edge ring changes due to consumption, the height of the sheath on the edge ring changes, making it difficult to control the etching characteristics such as the etching rate of the edge portion of the wafer. Therefore, a driving unit for driving the edge ring up and down is provided to control the position of the upper surface of the edge ring, thereby improving the controllability of the edge portion of the w...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L21/67H01L21/683H01L21/687G06F17/14
CPCH01L21/67011H01L21/6831H01L21/67103H01L21/68721H01L21/67259H01L21/02G06F17/14H01L21/68785H01L21/68735H01L21/67253H01J37/32972G01B11/06H01L21/67242H01L21/68742H01L21/67069H01L21/3065H01J37/32642H01J37/32733H01J2237/024G01S17/08H01J2237/3343H01J37/22H01J2237/21G01S17/06H01J37/3299H01J2237/334
Inventor 守屋瑠美子伴瀬贵德佐藤优秋月侑治谷川雄洋
Owner TOKYO ELECTRON LTD