Micro-light-emitting diode display panel, preparation method of micro-light-emitting diode display panel, spliced display panel and device

Abstract

The invention discloses a micro-light-emitting diode display panel, a preparation method of the micro-light-emitting diode display panel, a spliced display panel and a device, and is used for realizing a narrow frame while the yield of the micro-light-emitting diode display panel is ensured. The micro-light-emitting diode display panel provided by the embodiment of the invention is divided into adisplay area and a peripheral area located outside the display area; the peripheral area comprises a fan-out area and a bending area located between the fan-out area and the display area; the displayarea comprises a substrate, a flexible buffer layer, a pixel circuit and a micro-light-emitting diode device, wherein the flexible buffer layer is positioned on the substrate, the pixel circuit is located on the flexible buffer layer, and the micro-light-emitting diode device is located on the pixel circuit; the flexible buffer layer extends to the peripheral area; the fan-out area further comprises a driving circuit located on the flexible buffer layer; the bending area further comprises a lead located on the flexible buffer layer and electrically connected with the pixel circuit and the driving circuit, and a bending protective layer located on the lead; and the bending area is bent along a bending axis.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a micro-light-emitting diode display panel, a preparation method, a spliced ​​display panel, and a device. Background technique [0002] At present, display devices are developing towards ultra-thin, ultra-narrow bezel or even bezel-less. However, the current narrow bezels are basically difficult to achieve narrow four-sided bezels, especially for micro & mini LED display products, which need to use splicing technology to achieve large-size displays. In the existing technology, circuits are formed on the upper and lower sides of the micro & mini LED display panel, and then the front and back circuits are electrically connected through the side wiring scheme of the silver paste, so that the bonding (Bonding) area can be canceled to achieve a borderless design, but the side Lead technology requires chamfering on the glass edge, and due to the brittleness of glass, chamf...

AI Technical Summary

Problems solved by technology

However, the current narrow frame is basically difficult to achieve a narrow frame on all sides, especially for micro & mini LED display products, it is necessary to use splicing technology to achieve large-size display

In the existing technology, circuits are formed on the upper and lower sides of the micro & mini LED display panel, and then the front and back circuits are electrically connected through the side wiring scheme of the silver paste, so that the bonding (Bonding) area can be canceled to achieve a borderless design, but the side Lead wire technology requires chamfering on the glass edge, and due to the brittleness of glass, chamfering on the glass edge in the existing technology is prone to chamfering and chipping, and because the chamfer size is difficult to control, the process is more difficult to realize

[0003] To sum up, the narrow bezel technology of micro & mini LED display panels in the existing technology is difficult to process, and chamfering and edge chipping are prone to lead wire damage, which affects product production yield.

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