Chuck table
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[0025] figure 1 The illustrated processing device 1 is a device for turning a plate-shaped workpiece W held on a chuck table 30 of the present invention by a tool turning unit 6 having a tool tool 64. The front (-Y direction side) on the base 10 of the processing device 1 is used as an area for loading and unloading the plate-shaped workpiece W with respect to the chuck table 30, and the rear (+Y direction side) on the base 10 is used as turning by a tool The unit 6 is an area where the plate-shaped workpiece W held on the chuck table 30 is turned.
[0026] figure 1 The illustrated plate-shaped workpiece W is, for example, a semiconductor wafer having a circular outer shape with silicon as a base material, but it is not limited to this. In addition, the upper surface Wa of the plate-shaped workpiece W serves as a surface to be processed by turning. The lower surface Wb of the plate-shaped workpiece W is protected by pasting a protective tape (not shown).
[0027] An input unit 19...
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