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A semiconductor device molding method and a packaging mold for the molding method

A semiconductor and molding technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of quality risk control impact, breakdown, affecting the insulation of the molding body, etc.

Active Publication Date: 2022-07-05
SHENZHEN STS MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The problem of air holes in the molded body will affect the insulation of the entire molded body, and may cause problems such as breakdown and short circuit in high-voltage environments. There is a great risk in the actual application of the product, and it is an unacceptable defect type.
The problem of pores in the mold seal occupies a large proportion of the defects in the entire semiconductor mold seal process, which has a great impact on production cost control, quality risk control, etc.

Method used

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  • A semiconductor device molding method and a packaging mold for the molding method
  • A semiconductor device molding method and a packaging mold for the molding method
  • A semiconductor device molding method and a packaging mold for the molding method

Examples

Experimental program
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Effect test

Embodiment 1

[0068] Therefore, in the embodiment of the present application, as Figure 5-8 As shown in the figure, by opening the first groove 112 in the upper mold 11 that can form an external invalid cavity when the mold is closed, so that during the injection molding process, the mold flow located on the upper end face of the lead frame will directly face the outside after filling the upper layer of the lead frame. The dead cavity moves, and at the same time squeezes the residual air into the external dead cavity, instead of staying on the edge of the lead frame and falling to the lower end of the lead frame under the action of gravity, effectively avoiding the mold flow on the upper end of the lead frame and the mold on the lower end of the lead frame. The streams meet at the lower end of the lead frame, wrapping the air at the junction of the two mold streams.

[0069] Specifically, in this embodiment, the upper mold 11 is provided with a first mold sealing groove 111 , and the lower...

Embodiment 2

[0072] This example is Figure 9-12 As shown, the lower mold 12 is provided with a second groove 122, the upper mold 11 is provided with a connecting groove, the second groove 122 is suitable for forming an external invalid cavity when the mold is closed, and the connecting groove is suitable for forming a communication external invalid when the mold is closed. The connection between the cavity and the sealing cavity.

[0073] During the injection molding process, after filling the upper layer of the lead frame, the mold flow on the upper end surface of the lead frame will squeeze the air remaining on the upper end surface of the lead frame, so that the air can enter the external invalid cavity through the connecting channel. Specifically, the connecting groove communicates with the first molding groove 111 formed in the upper mold 11 .

Embodiment 3

[0075] This example is Figure 13-16 As shown, the upper mold 11 is provided with a third groove 113, the lower mold 12 is provided with a fourth groove 123 corresponding to the third groove 113, and the third groove 113 is suitable for the fourth groove 123 when the mold is closed. mate and form an external dead space.

[0076] During the injection molding process, the mold flow on the upper end face of the lead frame will squeeze the air remaining on the upper end face of the lead frame after filling the upper layer of the lead frame, so that the air can enter the external invalid cavity. The mold flow will fill the lower layer of the lead frame and squeeze the air remaining on the lower end face of the lead frame into the outer dead cavity to remove the air in the mold cavity, thereby avoiding the mold body formed after the resin in the mold cavity is cured. There are air bubbles or pores.

[0077] At least one external invalid cavity is provided to facilitate the mold fl...

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Abstract

The invention discloses a semiconductor device molding method. A chip is formed into a molding product through a semiconductor molding process. The semiconductor molding process includes: a mold assembling step, a vacuuming step, a material melting step, an injection molding and curing step, and an invalid area removal. step, the semiconductor device molding method can avoid gas remaining in the molding product to form bubbles or pores, and the present application also discloses a packaging mold for the semiconductor device molding method.

Description

technical field [0001] The present invention relates to the technical field of semiconductor device molding, in particular to a semiconductor device molding method and a packaging mold used for the semiconductor device molding method. Background technique [0002] The semiconductor molding process is also referred to as a semiconductor molding method. [0003] The semiconductor molding process is a commonly used process in the semiconductor industry. The process principle is: injecting molten resin material in a nearly closed molding cavity, and filling the molding cavity of the entire packaging mold through the flow of the resin material to wrap the entire chip. And part of the lead frame, and form semiconductor products. The purpose of the semiconductor molding process is to wrap the entire chip with resin material to protect sensitive structures such as chips, bonding wires, and components inside the semiconductor product, so that it will not be affected by the external ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56B29C45/26B29C45/27B29C45/14
CPCH01L21/56H01L21/565B29C45/26B29C45/27B29C45/14
Inventor 鲁强龙梁明林英灿石晓磊何豆
Owner SHENZHEN STS MICROELECTRONICS CO LTD