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A preparation method of mullite whisker low-temperature growth toughened aluminum phosphate-based high-temperature adhesive

A mullite whisker and aluminum phosphate-based technology is applied in the field of preparation of mullite whisker low-temperature growth and toughening aluminum phosphate-based high-temperature adhesives, which can solve the problem of high starting temperature and limit the increase of in-situ growth of mullite whiskers. The toughness technology can implement the temperature range and other issues to achieve the effect of improving the bonding effect, prolonging the fracture displacement and improving the bonding strength.

Active Publication Date: 2021-12-10
CIVIL AVIATION UNIV OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, AlF 3 The starting temperature of the function is high, that is, the mullite whisker growth temperature is high, usually higher than 1000 ° C, which seriously limits the executable temperature range of the in-situ growth and toughening technology of mullite whisker

Method used

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  • A preparation method of mullite whisker low-temperature growth toughened aluminum phosphate-based high-temperature adhesive
  • A preparation method of mullite whisker low-temperature growth toughened aluminum phosphate-based high-temperature adhesive
  • A preparation method of mullite whisker low-temperature growth toughened aluminum phosphate-based high-temperature adhesive

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Experimental program
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Effect test

Embodiment 1

[0026] The method for preparing mullite whisker low-temperature growth toughened aluminum phosphate-based high-temperature glue provided in this example includes the following steps in order:

[0027] (1) Aluminum hydroxide powder, kaolin powder and ammonium molybdate tetrahydrate powder are mixed in a weight ratio of 1.21:1:0.293, then placed in a high-energy ball mill, and ball milled for 3 hours at a speed of 600r / min to obtain whiskers growth precursors;

[0028] (2) Alumina powder, silicon powder, boron carbide powder and BYBSO 2 The low-temperature molten glass powder is fully mixed with a weight ratio of 1.75:2.5:1.5:1.5 to make a raw material mixture;

[0029] (3) Dilute concentrated phosphoric acid with a concentration of 85% to 60% with water, and place it in a water bath at 85°C, then mix aluminum hydroxide powder into dilute phosphoric acid, wherein the molar ratio of Al:P is 1: 1. Continue mechanical stirring until it becomes a milky white glue solution with a v...

Embodiment 2

[0032] (1) Aluminum hydroxide powder, kaolin powder and ammonium molybdate tetrahydrate powder are mixed in a weight ratio of 1.21:1:0.232, then placed in a high-energy ball mill, and ball milled at a speed of 600r / min for 2.5h to obtain a crystal whisker growth precursors;

[0033] (2) Alumina powder, silicon powder, boron carbide powder and BYBSO 2 The low-temperature molten glass powder is fully mixed with a weight ratio of 1.5:1.5:1.25:1.75 to make a raw material mixture;

[0034] (3) Dilute concentrated phosphoric acid with a concentration of 85% to 60% with water, and place it in a water bath at 85°C, then mix aluminum hydroxide powder into dilute phosphoric acid, wherein the molar ratio of Al:P is 2: 3. Continue mechanical stirring until it becomes a milky white glue solution with a viscosity of 1500mPa·s;

[0035] (4) the whisker growth precursor prepared in step (1), the raw material mixture prepared in step (2) and the glue solution prepared in step (3) are placed ...

Embodiment 3

[0037] (1) Aluminum hydroxide powder, kaolin powder and ammonium molybdate tetrahydrate powder are mixed in a weight ratio of 1.21:1:0.171, then placed in a high-energy ball mill, and ball milled at a speed of 650r / min for 2 hours to obtain whiskers growth precursors;

[0038] (2) Alumina powder, silicon powder, boron carbide powder and BYBSO 2 The low-temperature molten glass powder is fully mixed with a weight ratio of 1:1.75:1.75:2.25 to make a raw material mixture;

[0039] (3) Dilute concentrated phosphoric acid with a concentration of 85% to 60% with water, and place it in a water bath at 85°C, then mix aluminum hydroxide powder into dilute phosphoric acid, wherein the molar ratio of Al:P is 1: 2. Continue mechanical stirring until it becomes a milky white glue solution with a viscosity of 1500mPa·s;

[0040](4) the whisker growth precursor prepared in step (1), the raw material mixture prepared in step (2) and the glue solution prepared in step (3) are placed in a bal...

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Abstract

A method for preparing mullite whisker low-temperature growth toughened aluminum phosphate-based high-temperature glue. It includes using aluminum hydroxide powder, kaolin powder and tetrahydrate ammonium molybdate powder to prefabricate whisker growth precursors, mixing alumina powder, silicon powder, boron carbide powder and glass powder to prepare fillers, and using aluminum hydroxide and phosphoric acid The reaction solution is used as a glue solution, and finally the precursor, filler and glue solution are mixed to prepare an adhesive and other steps. The effect of the present invention: the high-temperature adhesive can grow mullite whiskers in situ at 700°C to be strengthened and toughened, and its bonding performance can be greatly improved in the range of 700°C to 1300°C. Especially after treatment at 1100°C, the adhesive showed excellent bonding effect. Compared with the blank sample without whisker growth, its bonding strength increased by 79.88%, reaching 49MPa, and the fracture displacement increased by nearly 164%. In addition, the high-temperature adhesive also exhibits a high resistance to damage tolerance, which fully demonstrates its high safety in use.

Description

technical field [0001] The invention belongs to the technical field of adhesive material preparation, and in particular relates to a method for preparing mullite whisker low-temperature growth toughened aluminum phosphate-based high-temperature adhesive. Background technique [0002] As a kind of inorganic adhesive, aluminum phosphate high-temperature adhesive has the characteristics of high temperature resistance, good bonding ability, can be cured at room temperature, good mixability and plasticity, and low price, so it has been widely used in aerospace, nuclear power, etc. and other industrial fields. According to reports, the aluminum phosphate high-temperature glue used by the Russian military can withstand high temperatures of 1700°C. Because of its high temperature resistance, the adhesive is also commonly used to make heat insulating materials and flame retardant materials. However, since most of its components are in the ceramic phase after high-temperature treatm...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/81C04B35/447
CPCC04B35/447C04B2235/5276C04B2235/3218C04B2235/349C04B2235/3821C04B2235/36C04B2235/447C04B2235/96
Inventor 王明超冯钊杰罗星娜卢若云
Owner CIVIL AVIATION UNIV OF CHINA
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