Double-layer board with turbulent flow column structure for cooling and vacuum electron beam machining method

A vacuum electron beam and electron beam processing technology, used in electron beam welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of large deformation of the plate, low processing accuracy, complex process, etc., and achieve fast and efficient preparation and processing. The effect of low cost and simple process

Inactive Publication Date: 2019-12-13
NANCHANG HANGKONG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] This method is complex in process, and the deformation of the plate during the preparation process is large, the processing accuracy is low, and the processing efficiency is low.
Using the

Method used

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  • Double-layer board with turbulent flow column structure for cooling and vacuum electron beam machining method
  • Double-layer board with turbulent flow column structure for cooling and vacuum electron beam machining method
  • Double-layer board with turbulent flow column structure for cooling and vacuum electron beam machining method

Examples

Experimental program
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Effect test

Embodiment 1

[0039] Such as Figure 1-4 As shown, this embodiment provides a double-layer panel with a spoiler column structure for cooling, including an upper panel and a lower panel, a gap is left between the upper panel and the lower panel, and a spoiler is arranged in the gap. In the stream column structure, the upper panel and the lower panel are connected together through the spoiler column structure.

[0040] In this implementation, the upper panel and the lower panel use metal plates; the thickness of the upper panel and the lower panel are the same or different, and the materials of the metal plates used in the upper panel and the lower panel are the same or different.

[0041] Wherein, the thickness of the upper panel and the lower panel is preferably 0.1 to 10 mm.

[0042] In this embodiment, the height of the spoiler structure is controlled by the height of the gap between the upper panel and the lower panel, which can be specified according to actual needs and manufacturing ...

Embodiment 2

[0053] Such as Figure 4-7As shown, this embodiment provides a double-layer panel with a spoiler column structure for cooling, including an upper panel and a lower panel, a gap is left between the upper panel and the lower panel, and a spoiler is arranged in the gap. In the stream column structure, the upper panel and the lower panel are connected together through the spoiler column structure.

[0054] In this implementation, the upper panel and the lower panel use metal plates; the thickness of the upper panel and the lower panel are the same or different, and the materials of the metal plates used in the upper panel and the lower panel are the same or different.

[0055] Wherein, the thickness of the upper panel and the lower panel is preferably 0.1 to 10 mm.

[0056] In this embodiment, the height of the spoiler structure is controlled by the height of the gap between the upper panel and the lower panel, which can be specified according to actual needs and manufacturing r...

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Abstract

The invention discloses a double-layer board with a turbulent flow column structure for cooling and a vacuum electron beam machining method and relates to the technical field of double-layer boards with cooling structures. Double-layer boards with the thickness being 0.1-10 mm are assembled together according to the set gaps; the assembled double-layer boards are conveyed into a vacuum electron beam vacuum chamber and fastened to a working table; vacuumizing is carried out until the vacuum degree is superior to 7*(10-4) Pa; electron beam surface focusing or defocusing is carried out, a machining path and parameters are edited, and the electron beam machining parameters are set to the proper range; according to the preset procedure, electron beam machining of the turbulent flow column structure for cooling between the double-layer boards is carried out on the designated portion, it is ensured that the upper board achieves penetration, and the lower board has a certain penetration depth,and metal molten on the upper board flows down and makes contact with the lower board to form the turbulent flow column structure; and after machining is completed, standing is carried out for 10-30minutes, a vacuum chamber is inflated, and the machined double-layer board is taken out. According to the double-layer board, the characteristic of the large penetration depth of high-vacuum electronbeam machining is utilized, and rapid machining of the turbulent flow column structure for cooling among the double-layer boards with different thicknesses and different gaps can be achieved.

Description

technical field [0001] The invention relates to the technical field of double-layer plates with a cooling structure, in particular to a double-layer plate with a spoiler column structure for cooling and a vacuum electron beam processing method. Background technique [0002] Due to its low density, high rigidity, good stability and good heat insulation performance, double-layer panels with cooling structure are widely used in aerospace, transportation, architectural decoration, military defense and other fields. [0003] At present, there are two commonly used double-layer board structures. One is to prepare double-layer boards by connecting the panels and cores by gluing. Therefore, it is often constrained by the adhesive. The other is to prepare double-layer plates by brazing. The brazing method requires a lot of equipment investment, a long brazing cycle, and high product costs. There are disadvantages such as difficulty in presetting materials and brazing filler metals....

Claims

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Application Information

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IPC IPC(8): B23K15/06B23K15/00
CPCB23K15/0033B23K15/06
Inventor 刘奋成陈悦夏春黄春平李春雨
Owner NANCHANG HANGKONG UNIVERSITY
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