A kind of binding method of tft target material and copper backplane

Abstract

The invention relates to the technical field of target material binding and particularly relates to a TFT target material and copper backboard binding method. The method comprises the following stepsthat (1), materials are prepared for standby use; (2) heating pretreatment is carried out, wherein a target blank and a backboard are heated at the same time; (3), metalization pretreatment is carriedout, wherein the target blank and the backboard are subjected to ultrasonic indium coating pretreatment; and (4) binding attaching treatment is carried out, wherein indium soldering flux is injectedinto a welding face of the backboard, and the position of the target blank is adjusted so that the target blank can be attached to a binding area of the backboard at a certain inclination angle. By means of the binding method, the binding quality of the TFT target material can be effectively improved, and the welded rate of the target material obtained through binding can reach up to 98.5%.

Description

technical field [0001] The invention relates to the technical field of target binding, in particular to a binding method of a TFT target and a copper backplane. Background technique [0002] As an advanced thin film material preparation technology, sputtering has two characteristics of "high speed" and "low temperature". It uses the ions generated by the ion source to accelerate and gather into a high-speed ion flow in a vacuum, and bombards the solid surface. The kinetic energy exchange occurs between the ions and the atoms on the solid surface, so that the atoms on the solid surface leave the target and deposit on the surface of the substrate, thereby forming a nanometer (or micron) films. The solid being bombarded is the material for depositing a thin film by sputtering, which is called a sputtering target. [0003] TFT targets are widely used in LCD TVs, computer screens and smart phones. In the existing TFT target binding process, due to the inclusion of many bubbles ...

AI Technical Summary

Problems solved by technology

[0003] TFT targets are widely used in LCD TVs, computer screens and smart phones. In the existing TFT target binding process, due to the inclusion of many bubbles and impurities in the binding layer, indium solder and the target blank and the back Many problems such as poor bonding performance of the plate and poor indium fluidity lead to poor binding quality of the TFT target, which in turn affects the stability of the subsequent coating process and the quality of the film, so it is necessary to improve

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