A kind of long tube rotation target binding method
A technology of rotating target and binding, applied in vacuum evaporation plating, coating, electrolysis components, etc., can solve the problems of poor welding effect at the connection port, many connection ports of the rotating target material, and many connection ports, etc., to achieve controllable It has the advantages of strong operability and operability, improving the bonding and welding rate, and reducing the difficulty of operation.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0166] A method for binding a long-tube rotating target, comprising the following steps: a. Step before pretreatment, sandblasting, cleaning and drying the inner sidewall of the whole tube of the target material and the outer sidewall of the back tube respectively;
[0167] b. The pretreatment step of the whole target tube and the back tube is to ultrasonically coat and bind the metal solder on the outer wall of the back tube after cleaning and drying to form a metallized layer of the back tube, and to clean and dry the inner side of the whole target tube The wall is brush-plated with a reinforced metal layer, and on the basis of the reinforced metal layer, ultrasonic coating is performed to bind metal solder to form a target metallization layer;
[0168] c. Assembly step, insert the back tube into the target tube, put positioning beads between the back tube and the target tube to form a pre-bound target, and position the beads to limit the distance between the back tube and th...
Embodiment 2
[0173] Embodiment 2 is different from embodiment 1 in that:
[0174] In d, in the binding step, start the internal heating device and the external heating device of the binding equipment to heat the pre-binding target to 225°C respectively, start the vibration device of the binding equipment to vibrate the pre-binding target as a whole, and pass The sprue pours the molten bonding metal solder with a temperature of 225°C into the bonding layer three times;
[0175] In e, the cooling step, the water cooling ring rises at a constant speed of 30 mm / min.
[0176] Wherein d, binding step and e, cooling step, the vibration frequency of the vibration device is 2850 times / min.
Embodiment 3
[0178] Embodiment 3 is different from embodiment 1 in that:
[0179] In d, in the binding step, start the internal heating device and the external heating device of the binding equipment to heat the pre-binding target to 300°C respectively, start the vibration device of the binding equipment to vibrate the pre-binding target as a whole, and pass The sprue is poured three times into the bonding layer with the bonding metal solder in the molten state at a temperature of 300°C;
[0180] In e, the cooling step, the water-cooling ring rises at a constant speed of 35 mm / min.
[0181] Wherein d, binding step and e, cooling step, the vibration frequency of the vibration device is 2900 times / min.
[0182] The binding and welding rates of the rotating targets obtained in Examples 1 to 3 were all above 99% through C-SCAN detection. In addition, the good product rate of the whole target binding is as high as 99.2%.
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



