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Binding method for rotating target material with high bonding strength

A rotating target and strength technology, which is applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problem of insufficient connection strength between the solder layer and the rotating target, and achieve high binding welding rate and simplified Process, the effect of eliminating pores

Active Publication Date: 2020-02-04
GUANGXI CRYSTAL UNION PHOTOELECTRIC MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is: aiming at the problem of insufficient connection strength between the solder layer and the rotating target in the prior art, to provide a high bonding strength rotating target binding method, which can eliminate the need to consider the target body , the thermal expansion coefficient of the solder layer and the backing tube, the bonded target has a good bonding strength, which eliminates the risk of the target body detaching from the backing tube in later use, thereby improving the utilization of the rotating target

Method used

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  • Binding method for rotating target material with high bonding strength
  • Binding method for rotating target material with high bonding strength
  • Binding method for rotating target material with high bonding strength

Examples

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Effect test

Embodiment 1

[0029] A method for binding a rotating target with high bonding strength, the specific steps are:

[0030] (1) Roughen the surfaces of the stainless steel backing tube and the 6-section molybdenum target tube respectively.

[0031] (2) Then wash and dry, and evenly coat a layer of high-temperature inorganic adhesive on the outer wall of the stainless steel liner and the inner wall of the molybdenum target tube (the high-temperature inorganic adhesive is mixed with 70-80% epoxy resin and 20-30% copper powder Composition), then heated to 120 ° C, and kept for 2 hours until the adhesive was completely solidified. Finally, for better wetting, the outer wall of the stainless steel backing tube and the inner wall of the molybdenum target tube were ultrasonically coated with indium.

[0032] (3) if Figure 1-Figure 2 As shown, the backing tube is vertically positioned and placed on the rotating platform, and then the 6-section molybdenum target tube is vertically inserted into the s...

Embodiment 2

[0034] A method for binding a rotating target with high bonding strength, the specific steps are:

[0035] (1) Roughen the surface of the backing tube titanium tube and the 6-section ITO target tube respectively.

[0036] (2) Then wash and dry, and uniformly coat a layer of high-temperature inorganic adhesive on the outer wall of the stainless steel liner and the inner wall of the ITO target tube (the high-temperature inorganic adhesive is mixed with 70-80% epoxy resin and 20-30% silver powder composition), then heated to 120°C, and held for 2 hours until the adhesive was completely solidified, and finally ultrasonically coated indium on the outer wall of the backing tube titanium tube and the inner wall of the ITO target tube.

[0037] (3) if Figure 1-Figure 2As shown, the backing tube is positioned vertically on the rotating platform, and then 6 sections of ITO target tubes are vertically inserted into the titanium tube of the backing tube. The tube gap formed by the stain...

Embodiment 3

[0039] A method for binding a rotating target with high bonding strength, the specific steps are:

[0040] (1) Roughen the surface of the backing tube titanium tube and the 6-section niobium oxide target tube respectively.

[0041] (2) Then wash and dry, and uniformly coat a layer of high-temperature inorganic adhesive on the stainless steel liner and niobium oxide target tube respectively (the high-temperature inorganic adhesive is composed of 70-80% epoxy resin and 20-30% graphite ), then heated to 120°C and kept warm for 2 hours until the adhesive was completely solidified, and finally the backing tube titanium tube and the niobium oxide target tube were ultrasonically coated with indium.

[0042] (3) if Figure 1-Figure 2 As shown, the backing tube is vertically positioned and placed on the rotating platform, and then the 6-section niobium oxide target tube is vertically inserted into the backing tube titanium tube, and the tube gap formed by the stainless steel liner tub...

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Abstract

The invention relates to a binding method for a rotating target material with high bonding strength. The binding method comprises the following steps that (1), the rotating target material and a backing tube are subjected to roughening treatment respectively; (2), a layer of high-temperature inorganic adhesive is respectively coated on the inner wall of the rotating target material and the outer wall of the backing tube, heating is conducted to 115 DEG C-125 DEG C, heat preservation is carried out for 1-3 h, and finally, the inner wall of the rotating target material and the outer wall of thebacking tube are ultrasonically coated with indium; and the high-temperature inorganic adhesive is composed of an epoxy resin and a substance A, wherein the substance A is one or more of copper powder, indium powder, silver powder and graphite; and (3) metallization of the rotating target material and the backing tube is carried out. According to the binding method, the coefficient of thermal expansion of the target material body, the solder layer and the backing tube can be not considered, the bound target material has good bonding strength, the risk that the target material body is separatedfrom the backing tube in later use is avoided, and the utilization rate of the rotating target material is improved.

Description

technical field [0001] The invention relates to a binding method for a magnetron sputtering coating rotating target, in particular to a binding method for a high bonding strength rotating target. Background technique [0002] Magnetron sputtering is one of the main technologies for preparing thin film materials, and it is widely used in technical fields such as electronic thin films, optical thin films, photoelectric thin films, magnetic thin films and superconducting thin films. With the development of science and technology, the coating industry has become a specialized industry, and the target market has further expanded. There are generally two types of sputtering targets: planar targets and rotating targets. [0003] At first, planar targets were used, and the utilization rate of planar targets was generally only 20% to 30%. With the advancement of technology, the transition to rotating targets was gradually started. The rotating targets rotate continuously during use,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/35
CPCC23C14/3414C23C14/35
Inventor 陈标郭朋刘所心马超宁
Owner GUANGXI CRYSTAL UNION PHOTOELECTRIC MATERIALS CO LTD
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