Braze bonded nail head lead
A nail-head lead wire and brazing technology, which is applied in the direction of welding equipment, welding equipment, arc welding equipment, etc., can solve problems such as bonding defects, brazing pads that are no longer flat, and interference with brazing bonding
Inactive Publication Date: 2019-12-13
鲁科斯钎焊材料有限公司
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] In particular, the welding process used to join such small brazed preforms can lead to deformation of the brazed preform due to the heat-affected zone of the solder joint
Such deformation will make the solder pad no longer flat
Additionally, gas entrapment, common in welding, can lead to bond defects that interfere with the functionality of the braze bond
Method used
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Embodiment Construction
[0027] With reference to the non-limiting embodiments detailed in the following description, the present invention and its various features and advantages will be more fully explained.
[0028] First reference figure 2 , Is a side view of the nail head lead 20 having a first end 22 and a shaft 24 extending from the first end 22. In a representative embodiment of the present invention, the first end 22 includes a first side 26 and a second side 28, and the shaft 24 extends from the second side 28 of the first end 22. Such as image 3 As shown in more detail in, the first end 22 of the nail head lead 20 may be a disc with a thickness 30 in the range of 0.007 to 0.015 inches ± 0.002 inches. The first end 22 of the nail head lead 20 may include an outer diameter 32 in the range of 0.030 to 0.150 inches ± 0.002 inches. Further, the diameter 34 of the shaft 24 may range from 0.020 to 0.060 inches ± 0.001 inches. In addition, the nail head lead 20 may have a length 36 ranging from 0.5...
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Abstract
A braze bonded nail head includes a nail head lead having a first end with first and second sides and a braze alloy preform coupled to the first side of the first end of the nail head lead. The brazebonded nail head further includes a weld joint centrally located on the braze alloy preform and extending through the braze alloy preform to the first end of the nail head lead. The weld joint is formed through micro-tig-welding, in alternative embodiments of the invention, one of the nail head lead and the braze alloy preform may include at least one protrusion extending therefrom, while the other of the nail head lead and the braze alloy preforms may include at least one interfit element configured to interfit with the at least one protrusion.
Description
Technical field [0001] The invention relates to a brazing nail head lead, wherein the nail head lead and a brazing alloy preform are formed into an integral part for brazing. Background technique [0002] Nail head leads and solder pads are currently used in combination in the diode industry to solder nail head leads to semiconductor chips. Traditional diode manufacturing is accomplished by using solder pads 14 made of silver, copper, and sometimes phosphorous alloys to connect nail head leads 10 made of copper or silver to molybdenum or tungsten studs on chip assembly 12. The assembly requires these components to be placed in the ceramic package 16 before entering the vacuum brazing operation as shown in FIG. 1. [0003] As shown in FIG. 1, the nail head leads 10, the solder pads 14, and the semiconductor chip 16 are aligned as separate components to solder the diode assembly 18. However, the incorrect alignment of the nail head lead 10 and the solder pad 14 may be due to incorr...
Claims
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IPC IPC(8): B23K1/00B22F3/00H01G4/228H01R13/648H05K3/40
CPCH01G4/228B23K9/0026B23K9/167B23K1/0016B23K2101/42H01L24/01H01L24/78H01L24/85H01L2224/78269H01L2224/7827H01L2224/85169H01L2224/85236H01L2924/01015H01L2924/01029H01L2924/01047
Inventor 迪恩·W·基克小保罗·朱利安·加格农戴维·李·万德瓦特
Owner 鲁科斯钎焊材料有限公司