Multilayer electronic component and method for manufacturing multilayer electronic component

Abstract

The present invention provides a laminated electronic component having a shielding layer on the outer surface and a highly recognizable mark, characters, numbers, etc. display on the top surface, and having a high yield rate. It includes: a laminated body 1, laminated with ceramic layers 1a-1h, having a bottom surface B, a top surface U, and a side surface S; at least one concave portion 8 is formed on the top surface U of the laminated body 1, and represents at least one of symbols, letters and numbers and electrodes 3, 4, 5, 6 formed between the layers of the laminated body 1, also equipped with a shielding layer 9 formed on the top surface U and the side surface S of the laminated body 1, on the inner bottom surface of the recess 8 of the laminated body 1 The electrode non-formation area NE where electrodes 3, 4, 5, and 6 are not formed is provided directly below the , and the thickness of the electrode non-formation area NE is set to be greater than or equal to the depth of the recess 8 starting from the inner bottom surface of the recess 8 .

Description

technical field [0001] The present invention relates to a laminated electronic component including a laminate in which a plurality of ceramic layers are laminated. [0002] Moreover, this invention relates to the manufacturing method of the multilayer electronic component suitable for manufacturing the multilayer electronic component of this invention. Background technique [0003] In the past, in electronic component modules incorporating IC (Integrated circuit; integrated circuit) components, there were many cases in which a shielding layer was formed on the outer surface so that the IC components would not malfunction due to noise intruding from the outside, and in order to prevent the IC components from malfunctioning. No noise is emitted to the outside. [0004] For example, Patent Document 1 (Japanese Patent No. 5779227) discloses an electronic component module (semiconductor device) in which a shield layer is formed on the outer surface. Figure 10 An electronic comp...

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Problems solved by technology

[0012] In a multilayer electronic component including a laminated body on which a ceramic layer is laminated, in the same manner as disclosed in Patent Document 1, recesses for displaying symbols, letters, numbers, etc. are formed on the top surface of the laminated body, and in order to suppress noise When the shielding layer is formed on the outer surface of the laminate through penetration, there is a possibility of inconvenience as follows

[0013] First, when a convex portion formed in a mold or the like is to be pressed into the top surface of an unfired laminate to form a concave portion for displaying a mark or the like, the electrode formed directly under the concave portion may be locally pressed to cause plasticity. Deformation may cause the electrode to break and cause cracks in the electrode

In addition, when it is intended to form a concave portion displaying a mark or the like by irradiating laser light on the top surface of the laminated body, there is heat caused by applying laser irradiation to the electrode formed directly under the concave portion, and the electrode is disconnected, and the electrode is disconnected. concern about cracks

[0014] In addition, stray capacitance may occur between the shield layer formed on the inner bottom surface of the concave portion formed on the top surface of the laminate and the electrodes formed inside the laminate, and the desired electrical characteristics may not be obtained.

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