A combined structure that controls heat conduction deformation in a closed state

Abstract

The invention relates to a combined structure for controlling thermal conduction deformation in a closed state. The structure includes a printing substrate, a supporting platform, a forming box, a ram and a guide rail. The printing substrate and the ram are respectively arranged on the upper and lower parts of the supporting platform by fasteners, and are connected as an integral structure, so A vertical guide rail is arranged between the ram and the forming box, and the ram drives the support plane and the printing substrate to move up and down in the closed space of the forming box through the guide rail, and inside the supporting platform An embedded preheating element is installed, a thermal insulation layer and an automatic thermal deformation adjustment structure are arranged between the ram and the support platform, and the thermal insulation layer is used to isolate the heat conduction to the ram and the guide rail. , During preheating, the thermal deformation automatic adjustment structure is used to adjust the vertical installation gap between the support platform and the ram, so as to eliminate the thermal deformation of the printing substrate caused by heat conduction.

Description

technical field [0001] The invention relates to the technical field of additive manufacturing, in particular to a combined structure for controlling thermal conduction deformation in a closed state. Background technique [0002] Selective laser melting is an important rapid prototyping technology, which uses laser to irradiate powder materials to realize the forming and solidification of workpieces. Preheating is an important link in the laser selective melting rapid prototyping process. Without preheating or improper preheating, the forming time will be increased, resulting in low performance and poor precision of the formed part, and even affecting the normal printing process. Therefore, the preheating process for the printed substrate is indispensable. As a result of preheating, heat conduction will occur, and the resulting thermal deformation of related equipment components will eventually affect the operation stability, precision and printing accuracy of the equipment....

AI Technical Summary

Problems solved by technology

As a result of preheating, heat conduction will occur, and the resulting thermal deformation of related equipment parts will eventually affect the operation stability, precision and printing accuracy of the equipment.

[0003] The existing way to solve the thermal deformation of the substrate is to apply a certain prestress to the substrate, but this method is mainly to reduce the influence of the laser heat source on the deformation of the substrate, and does not consider the influence of preheating, which has great limitations

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