Device and method for reducing warping degree of wafer, and semiconductor equipment
A warpage and wafer technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, electrical components, etc. Problems such as debris occur, and the effect of reducing wafer warpage, simple structure, and easy moving operation is achieved
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Embodiment 1
[0045] like figure 1 As shown, the present invention provides a device 1 for reducing wafer warpage, comprising: a chamber 11, a stage 12, a heating unit 14, a temperature control unit 15 and a hollow pressure ring 16; the stage 12 is located in the The chamber 11 is used to carry the wafers 13 to be processed; the heating unit 14 is located in the chamber 11 and is used to heat the wafers 13; the temperature control unit 15 and the heating The unit 14 is connected to control the heating temperature of the heating unit 14; the hollow pressure ring 16 is located above the carrier 12, and is used to press the wafer 13 to lower the wafer 13 degrees of warpage. In the present invention, the heating unit and the temperature control unit are used to adjust the temperature of the wafer to soften the wafer, and the hollow pressure ring is used to press the wafer to finally reduce the warpage of the wafer. The invention has simple structure and convenient use. Using the present inve...
Embodiment 2
[0058] like Figure 4 As shown, the present invention also provides a semiconductor equipment, including a wafer loading chamber 2, a process chamber 3, the device 1 for reducing wafer warpage described in the first embodiment, and a robotic arm 4, the robotic arm 4 is used for transferring wafers between the wafer loading chamber 2 , the process chamber 3 and the device 1 for reducing wafer warpage. For the introduction of the apparatus 1 for reducing the warpage of a wafer, please refer to the introduction of the first embodiment, which is not repeated for the sake of brevity.
[0059] In the semiconductor equipment of this embodiment, the wafer loading chamber 2 , the process chamber 3 and the device 1 for reducing the warpage of the wafer are independent of each other, and the robot arm 4 is used to carry out the wafer processing among them. For example, the robotic arm 4 takes out the wafer from the wafer loading chamber 2 and transfers it to the device 1 for reducing th...
Embodiment 3
[0062] like Figure 5 As shown, the present invention also provides another semiconductor device. The main difference between the semiconductor device of the present invention and the semiconductor device of the second embodiment is that in the semiconductor device of the second embodiment, the wafer loading chamber 2 , the process chamber 3 and the device 1 for reducing the warpage of the wafer are respectively In the semiconductor equipment of this embodiment, the wafer loading chamber 2 and the device 1 for reducing wafer warpage are connected with the process chamber 3 through a transfer chamber 5, and the mechanical The arm 4 is located in the transfer chamber 5 . Apart from that, the operation process of the semiconductor device of this embodiment is the same as that of the semiconductor device of the second embodiment. The robot arm 4 takes out the wafer from the wafer loading chamber 2 and transfers it to the lower wafer. Pretreatment is performed in the device 1 for...
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