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Manufacturing method of heat conduction PCB and PCB

A manufacturing method and technology of heat conductors, applied in the directions of circuit heating devices, multilayer circuit manufacturing, printed circuit manufacturing, etc., can solve problems such as limiting wiring density, prone to wrinkling, and inability to realize circuit manufacturing, so as to eliminate displacement and improve Effect of Overall Routing Density

Inactive Publication Date: 2019-12-27
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this manufacturing process, since the copper foil 4 on the outer layer has been window-opened before lamination, the window-opening position of the copper foil 4 is prone to wrinkling after high-temperature lamination. The conventional cushioning materials (such as aluminum sheet, release film, etc.) used will aggravate the degree of wrinkling, and the outer surface of the metal block 3 cannot realize circuit production, which limits the improvement of the overall wiring density

Method used

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  • Manufacturing method of heat conduction PCB and PCB
  • Manufacturing method of heat conduction PCB and PCB
  • Manufacturing method of heat conduction PCB and PCB

Examples

Experimental program
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Effect test

Embodiment 1

[0040] see image 3 The fabrication method flow chart of shown heat conduction PCB and Figure 4 The schematic diagram of the manufacturing method of the shown heat-conducting PCB, the manufacturing method of the heat-conducting PCB that the embodiment of the present invention provides, comprises:

[0041] Step 101 , making a thermal conductor 8 of specified specifications, the thermal conductor 8 includes a ceramic layer, a seed layer formed on the outer surface of the ceramic layer, and a conductive layer formed on the outer surface of the seed layer.

[0042] The thermal conductor 8 is used to realize the heat dissipation function, and its specific manufacturing method is: first form a seed layer on the upper and lower surfaces of a large ceramic sheet with a certain thickness, and then plate a conductive layer, such as a copper layer, to form a large copper-clad ceramic sheet; The large copper-clad ceramic sheet is divided into several small copper-clad ceramic sheets of ...

Embodiment 2

[0068] see Figure 5 The fabrication method flow chart of shown heat conduction PCB and Figure 6 The schematic diagram of the manufacturing method of the shown heat-conducting PCB, the manufacturing method of the heat-conducting PCB that the embodiment of the present invention provides, comprises:

[0069] Step 201 , making a thermal conductor 8 of specified specifications, the thermal conductor 8 includes a ceramic layer, a seed layer formed on the outer surface of the ceramic layer, and a conductive layer formed on the outer surface of the seed layer.

[0070] Step 202 , making the motherboard 5 .

[0071] Step 203 , making a thermal conductor accommodating groove 6 at a designated position on the motherboard 5 .

[0072] Step 204 , adhering a layer of micro-mucosa 7 on the first surface of the motherboard 5 .

[0073] Step 205, pre-filling the specified amount of resin 9 in the heat conductor storage tank 6, and then putting the heat conductor 8 into the heat conductor ...

Embodiment 3

[0082] This embodiment provides a PCB, which is manufactured according to the manufacturing method described in the first or second embodiment above. Since the embedded heat conductor 8 includes a ceramic layer and a conductive layer formed on the outer surface through the seed layer, the outer layer graphics can be made on the surface of the heat conductor 8 at the same time, which improves the wiring density of the PCB product.

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Abstract

The invention belongs to the technical field of PCBs and discloses a manufacturing method of a heat conduction PCB and a PCB. The manufacturing method comprises the following steps that: a mother board is manufactured, and then a heat conductor accommodating groove is formed in the mother board; a micro-viscous film is adhered to the mother board; a heat conductor is placed in the heat conductor accommodating groove and bonded to the micro-viscous film, and the heat conductor is fixedly connected with the mother board through resin, wherein the heat conductor comprises a ceramic layer and a conductive layer; the micro-viscous film is removed, and then the whole board is electroplated; and an outer-layer pattern is manufactured on the surface of the heat conductor and / or other board surfaces. According to the manufacturing method, the heat conductor accommodating groove is manufactured after a pressing process, so that windowing treatment on outer-layer copper foil is not needed beforepressing, and therefore, the good flatness of the outer-layer copper foil can be kept in the pressing process, and the wrinkling phenomenon of the outer-layer copper foil is avoided; the micro-viscousfilm can be used for pre-fixing the heat conductor and also can be used for preventing a large amount of redundant resin from being left on board surfaces; a copper-clad ceramic sheet is used as theheat conductor; a pattern can be also made on the conductive layer on the surface of the heat conductor; and therefore, the overall wiring density of the PCB is improved.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing a heat-conducting PCB and the PCB. Background technique [0002] The current mainstream PCB local heat dissipation technology mainly includes embedded metal block technology, which uses the high thermal conductivity of copper, aluminum and other metals to dissipate the heat generated by high-power devices on the surface of the PCB in time, thereby reducing the temperature of devices and equipment. Improves service life and electrical performance. [0003] Among them, the embedded metal block technology is usually applied to products formed by pressing the core board + core board, such as figure 1 As shown, the specific implementation method is as follows: first open windows at the corresponding positions of multiple core boards 1 and adhesive sheets 2, then stack the core boards 1 and adhesive sheets 2 in sequ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0204H05K3/4697
Inventor 肖璐吴泓宇纪成光方星王奕惠
Owner DONGGUAN SHENGYI ELECTRONICS
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