Array camera-based high-space resolution three-dimensional digital image measurement method
A high-spatial-resolution, array-type camera technology, applied to measuring devices, instruments, and optical devices, can solve the problems of affecting measurement results, reducing measurement time resolution, and slow frame rate of image transmission, so as to improve the matching speed , high-precision non-contact 3D full-field deformation measurement, and the effect of improving spatial resolution
Active Publication Date: 2020-01-03
SOUTHEAST UNIV
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Problems solved by technology
However, as pixel size decreases, the amount of incoming light available decreases and image noise increases, seriously affecting measurement results
At the same time, the larger chip size will slow down the image transmission frame rate, resulting in a reduction in the measurement time resolution
High cost image sensors and optics are also a consideration
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[0031] The present invention will be further described below in conjunction with the 3*3 array embodiment and the accompanying drawings.
[0032] The array-type high-resolution three-dimensional digital image correlation method for high-precision three-dimensional deformation measurement of the present invention comprises the following steps:
[0033] 1) Complete the processing and installation of two sets of 3×3 two-dimensional camera arrays, and at the same time formulate a camera array layout method that considers the out-of-plane deformation of the sample, so that in addition to ensuring the data continuity of the initial state, it can also ensure the state during the measurement process Continuity, there will be no overlapping areas between cameras that are too small or even non-overlapping.
[0034] For an array with a working distance of Z, when the object has an out-of-plane displacement ΔZ, the following relationship can be obtained according to the geometric relation...
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The invention provides an array camera-based high-space resolution three-dimensional digital image relevant measurement method. The method comprises the following steps of (1) processing, installing Nby N two-dimensional camera arrays, and completing an arrangement scheme of a left group of two-dimensional camera array and a right group of two-dimensional camera array, wherein N is more than or equal to 2; (2) fabricating a random speckle pattern on a surface of a measured sample; (3) building a measurement system, and forming a three-dimensional camera array; (4) calibrating a camera parameter in the three-dimensional camera array by a coding calibration plate; (5) allowing a camera in the three-dimensional camera array to simultaneously acquire a sample surface image by a synchronous acquisition device, and acquiring a position information carrier of the sample surface image; (6) performing time sequence matching and three-dimensional matching between array camera images on the position information carriers of the sample surface image acquired by the three-dimensional camera array; and (7) achieving correction and fusion splicing of displacement field data, and solving to acquire strain calculation. The method has the characteristics of high space resolution and is simple and convenient to operate.
Description
technical field [0001] The invention relates to the field of non-contact three-dimensional deformation measurement, in particular to a high spatial resolution three-dimensional digital image measurement method based on an array camera. Background technique [0002] The three-dimensional digital image correlation method is a non-contact optical full-field measurement method. It combines digital image correlation method and computer vision principle to accurately measure the three-dimensional shape and deformation of the object surface. Compared with several other measurement methods based on the principle of interference in photomechanics, it has many advantages, such as simple equipment, no need for vibration isolation, large measurement range, and controllable measurement range. At present, 3D digital image correlation technology is widely used in the fields of science and engineering. [0003] For the 3D digital image correlation method, its measurement resolution is mai...
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IPC IPC(8): G01B11/245G01B11/16G01B11/00
CPCG01B11/002G01B11/16G01B11/245G01B21/042
Inventor 邵新星魏康何小元
Owner SOUTHEAST UNIV