Semiconductor devices having recess in encapsulation material and associated production methods

Abstract

Embodiments of the present disclosure relate to a semiconductor device having a recess in an encapsulation material and an associated production method. The method comprises the steps: providing a least one semiconductor component, wherein each of at least one semiconductor component comprises: a semiconductor chip, and the semiconductor chip comprises a first main surface and a second main surface opposite the first main surface, and a sacrificial layer arranged above the opposite second main surface of the semiconductor chip. The method further comprises the step of encapsulating at least one semiconductor component with an encapsulation material. The method further comprises the step of removing the sacrificial material, wherein above each of at least one semiconductor chip a cutout isformed in the encapsulation material. The method further comprises the step of arranging at least one lid above at least one cutout, wherein a closed cavity is formed by at least one cutout and at least one lid above each of at least one semiconductor chip.

Description

technical field [0001] The present disclosure relates generally to semiconductor technology. In particular, the present disclosure relates to semiconductor devices having recesses in encapsulation materials and methods of manufacturing such semiconductor devices. Background technique [0002] In many applications, semiconductor chips contained in semiconductor devices must be protected from external influences. For this purpose, for example, semiconductor chips are embedded in an encapsulation material. The use of encapsulation materials can lead to undesired power losses in the operation of the semiconductor device. For example, coupling between the encapsulation material and electromagnetic waves emitted from the semiconductor device may occur, which may result in signal loss. Semiconductor device manufacturers are seeking to provide improved semiconductor devices and methods of manufacturing such semiconductor devices. In particular, it may be desirable to provide sem...

AI Technical Summary

Problems solved by technology

The use of encapsulation materials can lead to undesired power losses in the operation of semiconductor devices

For example, coupling between the encapsulation material and electromagnetic waves emitted from the semiconductor device may occur, which may result in signal loss

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