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Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method

A technology for photosensitive components and manufacturing methods, which is applied in the field of optics, can solve the problems of reducing I/O ports and increasing the number of pixels of photosensitive chips, and achieves the effect of packaging, high packaging, and high I/O count

Pending Publication Date: 2020-01-07
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And fewer pads lead to fewer I / O ports for output data
Therefore, the existing flip chip process is not conducive to the improvement of the number of pixels of the photosensitive chip

Method used

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  • Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method
  • Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method
  • Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method

Examples

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Embodiment Construction

[0055] For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are descriptions of exemplary embodiments of the application only, and are not intended to limit the scope of the application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0056] It should be noted that in this specification, expressions of first, second, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features. Accordingly, a first body discussed hereinafter may also be referred to as a second body without departing from the teachings of the present application.

[0057] In the drawings, the thickness, size and shape of objects have been slight...

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Abstract

The invention provides a photosensitive assembly, which comprises a photosensitive chip provided with a plurality of chip electrodes; a circuit board provided with a through hole corresponding to thephotosensitive area, wherein and the lower surface of the circuit board is provided with a plurality of first electrodes; a rewiring layer formed on the lower surface of the circuit board, wherein aplurality of second electrodes are arranged on the lower surface of the rewiring layer, and each of the plurality of first electrodes is electrically connected with the corresponding second electrodethrough a rewiring line; and a photosensitive chip attached to the lower surface of the rewiring layer, wherein the plurality of second electrodes are respectively contacted and conducted with the plurality of chip electrodes in a one-to-one correspondence manner. The invention further provides a manufacturing method of a corresponding photosensitive assembly, a corresponding circuit board assembly and a corresponding camera module. According to the invention, a circuit board bonding pad / circuit with a large line width can be conducted to the photosensitive chip with a smaller contact, and high-density packaging of the photosensitive chip of the camera module is realized.

Description

technical field [0001] The invention relates to the field of optical technology, in particular, the invention relates to a circuit board component, a photosensitive component, a camera module and a method for manufacturing the photosensitive component. Background technique [0002] With the rapid development of smartphones and other electronic devices, the demand for miniaturization of camera modules is becoming more and more intense as the screens of mobile phones tend to be full-screen and thinner. [0003] A camera module usually includes an optical lens assembly and a photosensitive assembly. The photosensitive component generally includes a circuit board and a photosensitive chip 103 mounted on the circuit board. In an existing camera module, the photosensitive chip 103 is usually connected to the circuit layer through a "gold wire" (ie, wire bond or wire bonding) process or a flip chip (ie, flipchip) process. [0004] Traditional printed circuit boards are limited by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225H01L27/146
CPCH01L27/14636H04N23/57H04N23/54H01L27/146
Inventor 王明珠黄桢田中武彦陈振宇郭楠赵波杰
Owner NINGBO SUNNY OPOTECH CO LTD
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