Stamp hole bonding pad surface mounting type image visual processing module
A surface mount, image vision technology, applied in the field of image processing, to achieve the effect of improving stability, good portability, and improving signal quality
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no. 1 example
[0045] Please refer to Figure 1-Figure 4 , in the first embodiment of the invention:
[0046] Stamp hole pad surface mount type image vision processing module includes:
[0047] PCB substrate 1;
[0048] ISP image processing chip 2, the ISP image processing chip 2 is installed on the top of the PCB substrate 1;
[0049] A resistance-capacitance sensing component 3, the resistance-capacitance sensing component 3 is installed on the top of the PCB substrate 1;
[0050] A power chip 4, the power chip 4 is mounted on the top of the PCB substrate 1;
[0051] A clock crystal 5, the clock crystal 5 is mounted on the top of the PCB substrate 1;
[0052] A firmware memory 6, the firmware memory 6 is mounted on the top of the PCB substrate 1 .
[0053] The ISP image processing chip 2 includes Camera SoC, Video, Image Controllers chips with image signal and media services.
[0054] A shielding case 7 is fixedly mounted on the top of the PCB substrate 1 .
[0055] The four sides of ...
no. 2 example
[0071] Please refer to Figure 5-6 The difference between this embodiment and the first embodiment is that a camera connector 9 is installed on the PCB substrate 1, the camera connector 9 is located in the shield 7, and the shield 7 is provided with an avoidance hole 11 , and the avoidance hole 11 is adapted to the camera connector 9, and the camera connector 9 is used for connecting external lens components.
no. 3 example
[0073] Please refer to Figure 7 The only difference between this embodiment and the first embodiment is that the PCB design of the PCB substrate 1 adopts a large copper pad 11 exposed at the bottom of the substrate.
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