Unlock instant, AI-driven research and patent intelligence for your innovation.

Thin Film Resistors for Probe Cards

A technology of thin film resistors and probe cards, which is applied in the direction of resistors, non-adjustable metal resistors, parts of electrical measuring instruments, etc., can solve the problem of crack increase and achieve the effect of preventing cracks

Active Publication Date: 2021-12-14
GIGALANE CO LTD
View PDF14 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, thin film resistors have a problem that the space transformer repeats expansion and contraction caused by heat while undergoing a thermal test when wafer inspection is performed, such as Figure 1a and Figure 1b As shown, a crack occurs in the resistance wire 200
[0009] With regard to this problem, recently, with the trend of increasing the number of probe pins for large-area wafer inspection, the number of thin film resistors is also increasing, and space transformers are constructed in place of multiple ceramic layers to form a multilayer ceramic-based substrate. A polyimide layer, in this trend, there is a problem that the thin-film resistor provided on the polyimide layer with a higher coefficient of thermal expansion than ceramics repeats expansion and contraction to a greater extent and the frequency of cracks increases.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin Film Resistors for Probe Cards
  • Thin Film Resistors for Probe Cards
  • Thin Film Resistors for Probe Cards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] The above purpose, features and advantages will be clarified by the detailed description to be described later with reference to the attached drawings, so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement the technical concept of the present invention. In addition, in the description of the present invention, when it is judged that the specific description of the known technology related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

[0048] Moreover, in the entire specification, when it is expressed that a certain part is "connected" to other parts, it is not only the case of "direct connection" but also the case of "electrical connection" with other devices interposed therebetween. In addition, when it is expressed that a certain part "includes" or "has" other constituent requirements, unless there is a specific contra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a thin film resistor for a probe card, and more particularly relates to a thin film resistor for a probe card that prevents cracks from being generated when the thin film resistor expands and contracts due to repeated heat. To this end, the thin film resistor of the present invention is connected to and provides resistance to a wiring ribbon cable formed in a space transformer that transfers signals between probe pins and a printed circuit board, and interfaces the signals, so The thin film resistor includes: a pair of electrode pads connected to the wiring ribbon cable; a resistance wire connected to the pair of electrode pads to provide resistance to the signal path; an elastic part formed by detouring the resistance wire; The void part is formed by being surrounded by the elastic part; and the elastic restricting part traverses the elastic void part and connects with the elastic part at one end and the other end, so as to limit the expansion and contraction of the elastic part.

Description

technical field [0001] The present invention relates to a thin film resistor for a probe card, and more particularly relates to a thin film resistor for a probe card that prevents cracks from being generated when the thin film resistor expands and contracts due to repeated heat. [0002] Here, a thin-film resistor refers to a resistor manufactured as a thin film by a method such as vapor-depositing a metal on a substrate. Background technique [0003] In general, probe cards are used to inspect wafers for abnormalities at the wafer stage, which is a stage before packages of semiconductors are manufactured. [0004] This probe card includes: a probe pin that contacts a wafer and receives a signal transmission; a PCB (Printed Circuit Board, printed circuit board) that receives a signal transmission from the probe pin and transmits a signal to a tester (tester); and A space transformer that transfers numbers between the probe pins and the PCB. [0005] This space transformer ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/073H01C7/00H01C13/02
CPCG01R1/04G01R1/073G01R1/20G01R31/28H01C7/00H01C13/02G01R1/203G01R1/07307G01R1/0491G01R31/2886
Inventor 李在桓李定美金永佑
Owner GIGALANE CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More