Contact deliquescene polishing device and polishing method for plasma modified liquid film
A plasma and polishing device technology, which is applied in the field of plasma modified liquid film contact deliquescence polishing device, can solve problems such as difficult cleaning and residual organic matter in micro pits, and achieve high-quality and efficient processing, improve surface quality, and high efficiency. Effect
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0024] see figure 1 As shown, the present invention provides a plasma-modified liquid film contact deliquescent polishing device, comprising a load block 1, a weight 2, a polishing pad 4, a polishing disc 5, a first flexible pipe 6, a second flexible pipe 7, a plasma Body generating device 8 and micro-vapor generating device 9.
[0025] The polishing pad 4 is installed on the upper surface of the polishing disc 5 .
[0026] The object loading block 1 is arra...
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