Contact deliquescene polishing device and polishing method for plasma modified liquid film

A plasma and polishing device technology, which is applied in the field of plasma modified liquid film contact deliquescence polishing device, can solve problems such as difficult cleaning and residual organic matter in micro pits, and achieve high-quality and efficient processing, improve surface quality, and high efficiency. Effect

Active Publication Date: 2020-01-10
HUNAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to disclose a plasma-modified liquid film contact deliquescent polishing device and polishing method, which can solve the technical problems of micro-pits and residual organic matter that are difficult to clean due to the residence of deliquescent polishing droplets in traditional deliquescent crystals.

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  • Contact deliquescene polishing device and polishing method for plasma modified liquid film
  • Contact deliquescene polishing device and polishing method for plasma modified liquid film
  • Contact deliquescene polishing device and polishing method for plasma modified liquid film

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see figure 1 As shown, the present invention provides a plasma-modified liquid film contact deliquescent polishing device, comprising a load block 1, a weight 2, a polishing pad 4, a polishing disc 5, a first flexible pipe 6, a second flexible pipe 7, a plasma Body generating device 8 and micro-vapor generating device 9.

[0025] The polishing pad 4 is installed on the upper surface of the polishing disc 5 .

[0026] The object loading block 1 is arra...

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Abstract

The invention provides a contact deliquescene polishing device for a plasma modified liquid film. The device comprises an object carrying block, a heavy object, a polishing pad, a polishing disc, a first hose, a second hose, a plasma generating device and a micro-mist generating device, wherein the polishing pad is mounted on the upper surface of the polishing disc, and the object carrying block is arranged above the polishing disc; and the heavy object is arranged on the object carrying block, wherein the object carrying block and the heavy object are used for applying pressure to a deliquescent crystal, through holes are formed in the positions, corresponding to the deliquescent crystal, of the polishing disc and the polishing pad, and the plasma generating device and the micro-mist generating device correspondingly communicate with the through holes through the first hose and the second hose. The invention further provides a polishing method for the plasma modified liquid film. Thecontact deliquescene polishing device and polishing method for the plasma modified liquid film has the beneficial effects that the problems that micro-pits and residual organic matters are difficult to clean caused by residing of liquid drops and the like in an existing deliquescence polishing method can be solved.

Description

【Technical field】 [0001] The invention relates to the technical field of ultra-precision processing of the surface of a deliquescent crystal, in particular to a plasma-modified liquid film contact deliquescent polishing device and a polishing method. 【Background technique】 [0002] In the current stage of micromachining, medical diagnosis, inertial confinement nuclear fusion and other experiments, some deliquescent optical crystals play an important role, including but not limited to LBO crystals, CBO crystals, KDP crystals, CLBO crystals, etc. Most of these deliquescent crystals are soft and brittle, sensitive to temperature changes, easy to crack, and anisotropic, making it difficult to achieve ultra-precision machining of the crystal surface. At present, there are the following problems in the ultra-precision processing of deliquescent crystals: 1) Small-scale ripples on the SPDT processed surface are unavoidable, difficult to repair surface micro-defects, and low process...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00
CPCB24B1/00
Inventor 黄帅何振湘
Owner HUNAN UNIV
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