A heat sink antenna array structure

Abstract

The invention relates to a fin antenna array structure, which comprises a finned metal heat sink, a metal base of the heat sink and a base plate. The upper surface of the substrate is connected to the metal base of the heat sink, and the lower surface is connected to the heat source chip. The metal base of the heat sink is provided with a rectangular through-cavity array as an antenna radiation aperture; the substrate includes multiple metal layers, and a dielectric is arranged between each metal layer layer, and the uppermost metal layer has a rectangular hole array corresponding to the rectangular cavity array of the metal base of the heat sink, and the dielectric layer contains a metal via array for forming the substrate integrated waveguide structure; the metal via array effectively reduces fin The channel thermal resistance between the chip-type metal heat sink and the heat source chip is formed, and the substrate integrated waveguide structure is formed as the feed network of the heat sink antenna. Compared with the prior art, the invention realizes the conformal structure of the antenna and the heat sink, and improves the integration degree of the system.

Description

technical field [0001] The invention relates to the technical field of antennas, in particular to a heat sink antenna array structure. Background technique [0002] With the continuous development of electronic communication technology, the application fields of miniaturized and highly integrated wireless communication systems are becoming more and more extensive. In the process of system design, in order to make full use of space resources and reduce energy loss caused by excessively long feeders, various active and passive devices including chips, front-end circuits and antennas are required to be integrated in a limited-sized package middle. At this time, although the total input power of the system is reduced, due to the reduction of the overall size, the thermal power per unit volume increases instead, which can easily cause the performance of the device to decrease, resulting in the system not working normally or even seriously damaged. . Therefore, in the actual de...

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Problems solved by technology

This method can improve the radiation efficiency of the microstrip patch antenna to a certain extent, but since the size of the heat sink base needs to be consistent with the size of the patch, when the operating frequency increases, the size of the patch decreases continuously with the shortening of the wavelength. The design space of the heat sink is greatly limited, resulting in the inability to achieve effective heat dissipation

The above problems are especially acute for mmWave antenna designs

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