Method for quickly judging hole deviation of OPE punched hole of HDI plate
A technology of punching and hole deviation, applied in the direction of tool positioning of circuit boards, electrical components, printed circuit manufacturing, etc., can solve the problems of low efficiency, time-consuming and laborious, and achieve the effect of simple and fast method and improved production efficiency.
Active Publication Date: 2020-01-17
珠海崇达电路技术有限公司 +1
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Problems solved by technology
[0005] The present invention aims at the problems of time-consuming, laborious and low-efficiency judging method of the OPE punching hole deviation of the current HDI board, and provides an intuitive judgment through the X-ray inspection instrument, which can quickly judge the OPE punching hole deviation method of the HDI board
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Embodiment
[0024] This embodiment provides a method for quickly judging the OPE punching hole deviation of the HDI board.
[0025] First, through the coating, exposure, development and etching processes in sequence, the inner layer circuit is made on the inner layer core board, and the positioning optical points (small PADs with a diameter of 1.5mm) are respectively made on the four sides of the inner layer core board, and on the inner layer core board. A positioning ring of the same size is respectively made at the four corners of the inner core board. In the same way, a positioning ring is made at the same position at the four corners of each inner core board and the size of the positioning ring is different from that of other inner core boards. When the inner core boards without expansion and contraction are stacked together , the vertical projection images of the positioning rings on each inner core board are concentric rings.
[0026] The method for quickly judging the deviation of...
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The invention relates to the technical field of printed circuit boards, in particular to a method for rapidly judging hole deviation of an OPE punched hole of an HDI plate. According to the invention,an X-ray detector is used for detecting and observing the relative position of positioning circular rings at the same position in a pre-stacked structure; if the positioning circular rings intersectwith each other / are tangent, a standby rivet hole is drilled by using the calibrated OPE punching equipment and the standby rivet hole is pre-riveted; and then the X-ray detector is used for detectingand observing the relative positions of the positioning circular rings at the same position in the pre-stacked structure again, and if the positioning circular rings do not intersect with each other / be tangent at the moment, it can be judged that the reason of interlayer alignment deviation of the pre-stacked structure is caused by deviation of the OPE punched hole previously. According to the method disclosed by the invention, whether deviation of the OPE punched hole exists in the rivet hole or not can be judged only by re-drilling the standby rivet hole and then directly observing the relative position of the positioning circular rings in the re-formed pre-staked structure by using the X-ray detector; quadratic elements do not need to be used for measuring the sizes of all layers of core plates for exclusion, the method is simple and rapid, and production efficiency can be remarkably improved.
Description
technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for quickly judging OPE punching hole deviation of HDI boards. Background technique [0002] The layer-to-layer alignment of high-density interconnect (HDI) boards is the technical focus and difficulty in its manufacturing process. Poor control of layer-to-layer alignment will cause serious quality problems such as mismatching of through-blind holes, internal opening, and internal shorting. There are many factors that affect the interlayer alignment accuracy of HDI boards, from the compensation coefficient of the inner core board, film control tolerance, exposure accuracy, etching shrinkage rate, drilling accuracy, process expansion and contraction, to the inner core board before lamination. OPE punching (ie, rivet hole punching) accuracy, riveting / fusion accuracy, and uniformity of pressure distribution during the pressing process all affect the interlaye...
Claims
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Login to View More IPC IPC(8): H05K3/00
CPCH05K3/0008H05K3/005
Inventor 寻瑞平杨勇戴勇汪广明
Owner 珠海崇达电路技术有限公司