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A processing method for plugging hole of rigid-flex board

A soft-rigid combination board and processing method technology, applied in the directions of printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of poor cover holes and thick thickness of the production solder mask ink, and solve the phenomenon of false copper leakage, ink leakage, etc. The effect of enhanced fluidity and improved production efficiency

Active Publication Date: 2022-01-18
珠海市凯诺微电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thickness of the flexible and rigid board is getting thicker and thicker according to the structure and layer, which leads to poor cover holes in the production of solder resist ink. This phenomenon is called false copper leakage.

Method used

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  • A processing method for plugging hole of rigid-flex board

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Embodiment Construction

[0016] In order to make the object, technical solution and advantages of the invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, and are not limited to the present invention.

[0017] see figure 1 , the processing method of the rigid-flex board plug hole of the present embodiment comprises the following steps:

[0018] A. Double-sided silk screen solder mask: Provide a circuit board, use plugging ink to fill the drill holes on both sides of the circuit board, and print solder resist ink on the surface of the circuit board. Wherein, before performing step A, a double-sided grinding step is also performed, and the double-sided grinding step includes: using a grinding machine to grind the circuit board to grind off the edge of the drilled hole. It can be seen that since ...

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Abstract

The invention discloses a method for processing plug holes of a soft-hard combination board. The method includes the following steps: A. Double-sided silk screen soldering resistance: provide a circuit board, use plugging ink to fill the drilled holes on both sides of the circuit board, and apply the plug hole ink on the circuit board B, double-sided alignment: perform solder mask film alignment on the circuit board after double-sided silk screen solder mask; C, double-sided exposure: perform photoimaging exposure on the aligned circuit board; D. Developing: put the circuit board after photoimaging exposure into the developing solution for developing; E. Curing; F. Gold: deposit nickel and gold on the exposed copper surface after developing. The invention can solve the false copper leakage phenomenon, avoid the risk of exposure holes, and improve product quality and efficiency.

Description

【Technical field】 [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for processing plug holes of a rigid-flex board. 【Background technique】 [0002] Rigid-flex boards are flexible circuit boards and rigid circuit boards, which are combined together according to relevant process requirements through pressing and other processes to form a circuit board with FPC characteristics and PCB characteristics-flex-hard circuit boards. [0003] The rigid-flex board has both the characteristics of FPC and PCB. Therefore, it can be used in some products with special requirements. It has both a certain flexible area and a certain rigid area, which saves the internal space of the product and reduces the The volume of the finished product is of great help to improve the performance of the product. [0004] In addition, in the design of flexible and rigid circuit boards, due to the limitation of product design and wiring space, vias are ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0094H05K3/0044
Inventor 刘俊伟李旭苹庄加东潘华
Owner 珠海市凯诺微电子有限公司