Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sealing film

An encapsulation film and encapsulation layer technology, applied in electronic equipment, applications, electrical components, etc., can solve problems such as the occurrence of OLED bright spots, and achieve the effect of preventing bright spots and improving process efficiency.

Active Publication Date: 2020-01-17
LG CHEM LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is the issue of OLED bright spots due to possible outgassing inside the OLED device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sealing film
  • Sealing film
  • Sealing film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0105] Fabrication of the magnetic layer

[0106] Fe particles (particle diameter about 1 μm to 10 μm, flake type) as magnetic particles were mixed with acrylic resin as binder resin in a weight ratio of 90:10 (magnetic particles: binder resin) to prepare dilute with toluene solution (50% solids).

[0107] The solution prepared above was applied to the release surface of the release PET using a comma coater, and dried in a dryer at 130° C. for 3 minutes to form a magnetic layer having a thickness of 30 μm.

[0108] Manufacture of encapsulation layer

[0109] A CaO (average particle size 3 μm) solution (solid content 50%) was prepared as a moisture adsorbent. Solutions (solid content 50%) in which 200 g of butyl rubber resin (BT-20, Sunwoo Chemtech) and 60 g of DCPD petroleum resin (SU5270, Sunwoo Chemtech) were diluted with toluene were prepared separately, and then the solutions were homogenized. Introduce 10 g of photocuring agent (TMPTA, Miwon) and 15 g of photoiniti...

Embodiment 2

[0116]An encapsulation film was produced in the same manner as in Example 1, except that Fe particles (particle diameter about 1 μm to 10 μm, flake type) as magnetic particles were mixed with Ni as a bright spot suppressor in the production of the magnetic layer. Particles (particle diameter about 300nm) were mixed at a weight ratio of 9:1, and acrylic resin as a binder resin was mixed with magnetic particles and bright spot suppressor at a ratio of 90:10 (magnetic particle + bright spot suppressor: binder resin ) in a weight ratio to prepare a solution diluted with toluene (50% solid content), and then form a magnetic layer.

Embodiment 3

[0118] An encapsulation film was manufactured in the same manner as in Example 2, except that the magnetic particles and the bright spot suppressor were mixed in a weight ratio of 6:4.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The present application relates to a sealing film, a method for preparing same, an organic electronic device comprising same and a method for preparing an organic electronic device using same. Provided is a sealing film which enables forming of a structure blocking moisture or oxygen from flowing into an organic electronic device from outside, effective emission of heat accumulates inside the organic electronic device, and prevention of bright spots generated on the organic electronic device.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims the benefit of priority based on Korean Patent Application No. 10-2017-0072499 filed on June 9, 2017, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] The present application relates to an encapsulating film, a method for manufacturing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same. Background technique [0004] An organic electronic device (OED) means a device including an organic material layer that generates an exchange of charges using holes and electrons, and examples thereof may include photovoltaic devices, rectifiers, emitters, organic light emitting diodes (OLEDs), and the like. [0005] Organic light emitting diodes (OLEDs) among the above organic electronic devices have less power consumption and faster response speed than existin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52B32B7/02B32B27/20B32B27/08
CPCH10K50/846H10K50/87H10K50/844B32B7/02B32B27/20B32B27/08B32B2307/208B32B2307/302B32B7/12B32B9/005B32B15/08B32B2307/724B32B2457/206H10K71/00H10K2102/351
Inventor 柳浩俊柳东桓申世镐申汶哲郑燻柳在说
Owner LG CHEM LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com