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High-frequency probe card device and its signal transmission module

A high-frequency probe and card device technology, applied in the field of high-frequency probe cards, to achieve the best transmission effect

Active Publication Date: 2021-09-28
CHUNGHWA PRECISION TEST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention is to provide a high-frequency probe card device and its signal transmission module, which can effectively improve the defects that may occur in the existing high-frequency probe card

Method used

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  • High-frequency probe card device and its signal transmission module
  • High-frequency probe card device and its signal transmission module
  • High-frequency probe card device and its signal transmission module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Such as figure 1 As shown, it is Embodiment 1 of the present invention. This embodiment discloses a high-frequency probe card device 100, which can be used to test an object under test (not shown in the figure, such as a semiconductor chip). What needs to be explained first is that, in order to facilitate understanding of this embodiment, the accompanying drawing is a partial plan view of the above-mentioned high-frequency probe card device 100 for illustration.

[0026] The high-frequency probe card device 100 includes a support 1, a transmission layer 2 disposed on the support 1, a plurality of detection bumps 3 arranged on the transmission layer 2, and positions corresponding to the support A circuit board 4 of the component 1 and a coaxial cable 5 configured on the transmission layer 2 and the circuit board 4 . The structure of each component of the high-frequency probe card device 100 will be introduced below, and the connection relationship between the component...

Embodiment 2

[0047] Such as figure 2 As shown, it is Embodiment 2 of the present invention. This embodiment is similar to the above-mentioned Embodiment 1, and the similarities between the two embodiments will not be described in detail. The difference between this embodiment and the above-mentioned Embodiment 1 mainly lies in : The structure of the transmission layer 2 and the support 1 .

[0048] The circuit board 4 and the corresponding detection bump 3 ′ are electrically coupled to each other only through the transmission layer 2 in this embodiment; that is, there is no connection between the transmission layer 2 and the conductive elastic member 132 . There is no electrical connection, and the plurality of conductive elastic members 132 are only used to provide the elastic force required for the support member 1 to move back and forth, but are not used for signal transmission. Moreover, the connecting board 11 is only used as a bearing part of the positioning structure 12 , but is n...

Embodiment 3

[0054] Such as image 3 As shown, it is the third embodiment of the present invention. This embodiment is similar to the above-mentioned embodiment two. : The support member 1 of the present embodiment is a plunger (plunger) of a single-piece construction.

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Abstract

The invention discloses a high-frequency probe card device and its signal transmission module. The signal transmission module includes a transmission layer, a plurality of detection bumps arranged on the transmission layer, and electrically coupled to at least one of the detection bumps. A circuit board and a coaxial cable. The circuit board is formed with a through-shaped connection hole. The coaxial cable includes a passing section, an embedded end section and an external end section located on opposite sides of the passing section, the passing section is located in the connecting hole, and the embedded end section is located in the connecting hole. Segments are buried and fixed within the transmission layer. Wherein, the coaxial cable includes a core wire and a mesh shielding layer surrounding the core wire, and the core wire part located at the embedded end section is electrically coupled to one of the Detect bumps. Accordingly, the detection bump electrically coupled to the core wire of the above-mentioned coaxial cable can directly transmit the detected signal to the test machine through the coaxial cable, so as to have a better transmission effect .

Description

technical field [0001] The invention relates to a high-frequency probe card, in particular to a high-frequency probe card device and a signal transmission module thereof. Background technique [0002] The existing high-frequency probe card includes a plunger, a flexible circuit board partially disposed on the end surface of the plunger, and a plurality of detection bumps fixed on the flexible circuit board. Wherein, each of the detection bumps has no elasticity, and the detection bumps are used to abut against and electrically couple to an object under test, and transmit corresponding signals through the above-mentioned flexible circuit board. [0003] However, due to the high dissipation factor (disspation factor, DF) of the flexible printed circuit board, the flexible printed circuit board is prone to large losses during the signal transmission process, and the water absorption rate of the material is also high, so In micro-pitch applications, there is a risk of leakage, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01R1/067
CPCG01R1/067G01R31/2801
Inventor 李文聪谢开杰
Owner CHUNGHWA PRECISION TEST TECH