Vacuum packaging method for super large to photoelectric housing
A vacuum packaging and photoelectric technology, which is applied in the direction of circuits, electrical components, and electrical solid devices, can solve the problems that energy storage welding equipment cannot be vacuum packaged, and achieve the effects of strong practicability, good effect, and high design precision
Active Publication Date: 2021-07-20
THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
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[0035] The present invention will be further described below in conjunction with accompanying drawing.
[0036] In the description of the present invention, unless otherwise specified and limited, it should be noted that the term "connection" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be the internal communication of two elements, it can be Directly connected or indirectly connected through an intermediary, those skilled in the art can understand the specific meanings of the above terms according to specific situations.
[0037] The specific implementation of the present invention will be explained in detail below in conjunction with the examples.
[0038] The tube cap 1 of the ultra-large TO photoelectric housing used in this embodiment has a diameter of 47.00 mm to accommodate the ultra-large-area silicon drift chamber detector. ;Such as Figure 1a and Figure 1b As shown, the tube base 3 is ...
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Abstract
The invention discloses a vacuum encapsulation method for a super-large TO photoelectric housing, which comprises the following steps: firstly installing a vacuum pipe on the tube cap of the photoelectric housing, then packaging a detector in the photoelectric housing, and then using energy storage welding equipment to weld the tube cap and the photoelectric housing. Then connect the vacuum pipeline to the vacuum pump to vacuumize the photoelectric housing; when the vacuum degree is less than or equal to the predetermined value, turn off the vacuum pump and use sealing pliers to cut the vacuum pipeline to form an airtight packaging structure. In the present invention, by installing the vacuum pipeline on the TO photoelectric housing, the limitation of the size of the TO photoelectric housing by the energy storage welding equipment can be avoided, and the vacuum packaging of the super large TO photoelectric housing can be realized. At the same time, the TO photoelectric housing, the vacuum pipeline and the The mutual influence of the vacuum pump interface structure, high design precision, good vacuum packaging effect, and strong practicability.
Description
technical field [0001] The invention relates to the field of vacuum packaging of image sensors, in particular to a vacuum packaging method for an ultra-large TO photoelectric housing. Background technique [0002] In the vacuum packaging process of the conventional TO photoelectric housing, a closed structure device is added outside the upper and lower electrodes of the energy storage welding equipment. There is a vacuum processing pipeline at the bottom of the device, which is connected to a vacuum pump. [0003] In the process of vacuum encapsulation, first place the TO tube cap and base on the upper and lower fixtures of the energy storage welding equipment, then close the closed structure device, turn on the vacuum pump, and when the specified vacuum degree is reached, start the energy storage welding power supply, and the TO tube cap The sealing area of the tube base achieves interatomic bonding to realize the airtight seal between the TO tube cap and the tube base. ...
Claims
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IPC IPC(8): H01L23/02B23K28/00
CPCB23K28/00H01L23/02
Inventor 陈于伟陈雯静冯晨黄雪
Owner THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP