Display panel and display device

Abstract

The invention provides a display panel and a display device. The problem that the display effect of an existing display panel is affected due to the large contact resistance in the bonding process, the mutual connection of printed circuits and the overflow of metal of the printed circuits can be solved. The display panel comprises an array substrate and an opposite substrate which are oppositely arranged, and a plurality of chip-on-films. Each chip-on-film is electrically connected with a conductive region of the array substrate through a printed circuit. Each conductive region and the printedcircuit corresponding to the conductive region comprise a first contact located on the side face of the display panel and a second contact located on the side, facing the opposite substrate, of the conductive region, and therefore, the conductive contact area is increased. In addition, first blocking structures and second blocking structures are further arranged on the sides, facing the oppositesubstrate, of the conductive regions and nonconductive regions of the array substrate, so that the problem that the display effect is affected due to the fact that the adjacent printed circuits are connected with each other and metal of the printed circuits overflows into a display region can be prevented.

Description

technical field [0001] The invention relates to the display field, in particular to a display panel capable of reducing contact resistance and preventing connection, and a display device using the display panel. Background technique [0002] The display device includes a display panel and a driver IC (Integrated Circuit, IC) for driving the display panel, wherein the driver IC is used for a source driver (Source Driver) and a gate driver (Gate Driver) of the display driver. Currently, many display panels, such as LCDs and OLEDs, use chip-on-film (Chip On Film, COF) packaging technology for driver ICs. [0003] Chip-on-chip technology, as the name suggests, is a technology that fixes the driver IC on the grain soft film of a flexible printed circuit (FPC). In the driving circuit, one end of the COF is connected to the printed circuit board (Printed Circuit Board, PCB), which is responsible for receiving the data signal transmitted by the printed circuit board, and the other ...

AI Technical Summary

Problems solved by technology

[0005] However, side bonding will cause problems such as large contact resistance between the chip-on-chip film and the bonding area in the display panel, and easy connection of the connected circuit of the adjacent chip-on-chip film.

At present, enlarging the distance between the conductive regions 12a in the display panel can overcome the connection problem, but it will increase the width of the chip-on-chip film, making bonding more difficult, or even impossible

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