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Method for preparing flexible sensor

A flexible sensor, viscoelastic technology, applied in the field of flexible sensors, can solve problems such as complex process

Active Publication Date: 2021-08-24
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process of separately forming electrodes and semiconductor functional layers on flexible substrates is often complicated

Method used

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  • Method for preparing flexible sensor
  • Method for preparing flexible sensor
  • Method for preparing flexible sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] use figure 1 In the process shown, the roll of optical transparent tape is placed on roll 101 to be peeled off and transported by roll 102 and roll 103, and roll 204 is a well-patterned and plasma-treated surface energy film carried on the support layer. The low nano-silver film coil is pressed by the 201 roller and the 202 roller to transfer the nano-silver to the optical transparent tape to form a patterned electrode layer. Roller 304 is a roll of patterned CdS nanowires and ZnO nanowires. On this basis, the patterned electrode layer on the optical transparent tape is pressed by rollers 301 and 302 to transfer the semiconductor functional layer to the optical film. Scotch tape. Complete the preparation of the photodetector. Roller 403 is a roll with a release film, and the prepared photodetector tape attaches the release film of the protective layer to the prepared device through the pressing of rollers 401 and 402. Finally, the winding is completed by the 404 roll...

Embodiment 2

[0068] Place the roll of optical transparent tape on roll 101 and pass through roll 102 and roll 103 to remove and transport it. Roll 204 is a nano-silver film roll that has been patterned and has been treated with plasma and has low surface energy. Roll through roll 201 Pressing with the 202 roller makes the nano-silver transfer to the optical transparent tape to form a patterned electrode layer. Roller 304 is the roll material of the patterned electronic ink capsule. On this basis, the patterned electrode layer on the optical transparent tape is pressed by rollers 301 and 302 to transfer the patterned electronic capsule block to the optical film. scotch tape as figure 2 , to complete the transfer of the capsule layer. Then, the transfer of the nano-silver electrode is repeated using the rollers 501-504 of the second electrode layer transfer section to prepare the upper electrode. Roller 403 is a roll with a release film. The prepared electronic paper structure is attached...

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Abstract

The present disclosure provides a method for preparing a flexible sensor, which directly uses adhesive tape as the substrate of the sensor, and transfers electrodes and functional layers to the adhesive tape through a roll-to-roll process, so that large-scale, large-area, high-precision, high-efficiency to prepare flexible sensors.

Description

technical field [0001] The present disclosure relates to the field of flexible sensors, and more particularly, to a method for preparing a flexible sensor. Background technique [0002] Flexible electronic devices have been extensively studied in the application of wearable sensors due to their bendability, suitability for solution-state fabrication, and high sensitivity. Flexible sensors usually consist of electrodes and semiconductor functional layers on a flexible substrate. The process of separately forming the electrodes and the semiconductor functional layer on the flexible substrate is usually complicated. [0003] For large-scale, large-area, high-precision, and high-efficiency fabrication of flexible sensors, there is still a need for improvement. Contents of the invention [0004] The present disclosure provides a method for preparing a flexible sensor, characterized in that the method comprises: [0005] providing tape from a substrate take-up roll to a subst...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L21/67
CPCH01L21/56H01L21/67132
Inventor 吴志鸿杨柏儒
Owner BOE TECH GRP CO LTD