Position sensor
A sensor and sensor chip technology, applied in the direction of converting sensor output, using electric/magnetic devices to transfer sensing components, instruments, etc., can solve problems such as signal phase difference and inter-system error
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no. 1 Embodiment approach
[0049] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. The position sensor of this embodiment is a sensor that detects which range (state) the position of the detection object is in, and outputs a signal corresponding to the range.
[0050] Such as figure 1 As shown, the position sensor 100, as a detection object, detects the position of the shaft rod 200 linked to the movement of the gear position of the vehicle. Specifically, the position sensor 100 detects a signal corresponding to the position of the protrusion 201 provided on the shaft 200 to acquire the state of the shaft 200 .
[0051] The state of the shaft 200 refers to the position of the shaft 200 when a gear is operated by the user. For example, the shaft 200 moves in conjunction with parking. Such as figure 1 As shown, the shaft 200 moves axially when operated such that the gear is in Park. Thus, the shaft 200 reflects the state of parking. The posit...
no. 2 Embodiment approach
[0115] In this embodiment, differences from the first embodiment will be described. Such as Figure 23 and Figure 24 As shown, the first half-bridge circuit 123 and the second half-bridge circuit 124 are arranged in layers on one surface 129 of the sensor chip 110 . In the present embodiment, the wiring patterns of the respective half-bridge circuits 123 and 124 are formed in layers so that the wiring pattern of the first half-bridge circuit 123 is located on the side 129 of the sensor chip 110 .
[0116] Specifically, the respective resistor units 125 and 126 of the first half-bridge circuit 123 are formed on one surface 129 of the sensor chip 110 . An interlayer insulating film 139 is formed on one surface 129 of the sensor chip 110 so as to cover the respective resistance portions 125 and 126 . In addition, the respective resistance portions 127 and 128 of the second half-bridge circuit 124 are formed on the interlayer insulating film 139 . Furthermore, a protective fi...
no. 3 Embodiment approach
[0120] In this embodiment, differences from the first and second embodiments will be described. In the case of using a magnetic detection method using a Hall element, such as Figure 25 floor plan and Figure 26 As shown in the schematic cross-sectional view of , the molded IC part 105 is inserted into and fixed to the holding part 107 . Furthermore, the molded IC part 105 has a lead frame 108 , an IC chip 141 , a magnet 142 , and a molded resin part 111 .
[0121] The island portion 112 of the lead frame 108 is arranged such that the planar portion is parallel to the moving direction of the detection object. On the other hand, the respective lead wires 113 to 115 are arranged perpendicular to the moving direction of the detection object. The lead wire 114 for ground is integrally formed at right angles to the island portion 112 . Terminal posts 116 are respectively connected to the tips of the lead wires 113 to 115 .
[0122] The IC chip 141 is formed with a plurality of...
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