Cyanide-free alkaline cuprous plating additive

Abstract

The invention relates to the technical field of metal corrosion protection and surface treatment, in particular to a cyanide-free alkaline cuprous plating additive. The additive comprises 50-200 partsof complexing agent, 0.1-20 parts of stabilizer, 0.01-0.5 part of brightener, 0.1-5 parts of leveling agent, 10-20 parts of NaOH, 5-20 parts of Na2CO3 and 15-50 parts of cuprous compound. The additive does not contain cyanide and organic phosphonate, is suitable for cyanide-free alkaline copper plating electroplating solution taking cuprous salt as main salt, and effectively solves the problem that traditional cyanide-free alkaline copper plating generates a loose plating layer with poor binding force due to displacement reaction; meanwhile, a certain activation effect can be generated on a steel substrate, a copper coating with good binding force can be obtained on the steel substrate, and the additive is safe, efficient and environmentally friendly.

Description

technical field

[0001] The invention relates to the technical field of metal corrosion protection and surface treatment, in particular to a cyanide-free alkaline cuprous copper plating additive. Background technique

[0002] As a soft metal with metallic luster, easy machining and good electrical conductivity and ductility, copper is widely used in protective decorative coatings such as automobiles, building materials, electroplating pre-plating, and circuit chip technology. There are many kinds of plating solutions that can obtain copper plating, which can be divided into cyanide copper plating and cyanide-free copper plating according to the toxicity; cyanide copper plating has strong plating ability and covering ability, high bonding force with steel substrate, and The crystallization is fine and easy to maintain; however, the electrolyte contains a large amount of highly toxic cyanide, which seriously endangers the atmospheric environment and the health of operators. Ac...