Cyanide-free alkaline cuprous plating additive

An additive and cuprous technology, which is applied in the field of cyanide-free alkaline cuprous copper plating additives, can solve the problems of difficult direct electroplating and passivation of steel substrates, and achieve the effects of easy deposition, refined metal crystals, and inhibition of discharge precipitation

Inactive Publication Date: 2020-02-07
武汉奥邦表面技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The cyanide-free copper plating process that replaces cyanide copper plating is mainly a divalent copper process, but this type of process is prone to copper replacement and pas

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A cyanide-free alkaline cuprous copper plating additive, the additive composition is as follows: 50 parts of complexing agent, 0.1 part of stabilizer, 0.01 part of brightener, 0.1 part of leveling agent, 10 parts of NaOH, NaOH 2 CO 3 5 parts, 15 parts of cuprous compound, the selected brightener and leveling agent can be adsorbed on the surface of the cathode, exerting a synergistic effect, inhibiting the discharge and precipitation of metal ions, thereby refining the metal crystal, and the leveling agent can slowly desorb on the surface of the electrode And adsorption, the adsorption concentration at the microscopic peak on the cathode surface is higher than that at the microscopic low peak, so that the precipitation of metal ions at the peak is more inhibited, making it easier to deposit at the low peak, showing leveling .

[0022] The main components of the complexing agent are the reaction product of organic amine and carbon disulfide or thiourea and derivatives t...

Embodiment 2

[0037] A cyanide-free alkaline cuprous copper plating additive, the additive is composed as follows: 200 parts of complexing agent, 20 parts of stabilizer, 0.5 part of brightener, 5 parts of leveling agent, 20 parts of NaOH, NaOH 2 CO 3 20 parts, 50 parts of cuprous compound, the selected brightener and leveling agent can be adsorbed on the surface of the cathode, exert a synergistic effect, inhibit the discharge and precipitation of metal ions, thereby refining the metal crystals, and the leveling agent can slowly dissolve on the surface of the electrode Desorption and adsorption, the adsorption concentration at the microscopic peak on the cathode surface is higher than that at the microscopic low peak, so that the precipitation of metal ions at the peak is more inhibited, making it easier to deposit at the low peak, showing leveling sex.

[0038]The main components of the complexing agent are the reaction product of organic amine and carbon disulfide or thiourea and deriva...

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PUM

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Abstract

The invention relates to the technical field of metal corrosion protection and surface treatment, in particular to a cyanide-free alkaline cuprous plating additive. The additive comprises 50-200 partsof complexing agent, 0.1-20 parts of stabilizer, 0.01-0.5 part of brightener, 0.1-5 parts of leveling agent, 10-20 parts of NaOH, 5-20 parts of Na2CO3 and 15-50 parts of cuprous compound. The additive does not contain cyanide and organic phosphonate, is suitable for cyanide-free alkaline copper plating electroplating solution taking cuprous salt as main salt, and effectively solves the problem that traditional cyanide-free alkaline copper plating generates a loose plating layer with poor binding force due to displacement reaction; meanwhile, a certain activation effect can be generated on a steel substrate, a copper coating with good binding force can be obtained on the steel substrate, and the additive is safe, efficient and environmentally friendly.

Description

technical field [0001] The invention relates to the technical field of metal corrosion protection and surface treatment, in particular to a cyanide-free alkaline cuprous copper plating additive. Background technique [0002] As a soft metal with metallic luster, easy machining and good electrical conductivity and ductility, copper is widely used in protective decorative coatings such as automobiles, building materials, electroplating pre-plating, and circuit chip technology. There are many kinds of plating solutions that can obtain copper plating, which can be divided into cyanide copper plating and cyanide-free copper plating according to the toxicity; cyanide copper plating has strong plating ability and covering ability, high bonding force with steel substrate, and The crystallization is fine and easy to maintain; however, the electrolyte contains a large amount of highly toxic cyanide, which seriously endangers the atmospheric environment and the health of operators. Ac...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 蒋晟吕明威吕志
Owner 武汉奥邦表面技术有限公司
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