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Electroplating solution for direct cyanide-free copper plating of steel matrix under strong acidic condition and preparation method of electroplating solution

A cyanide-free copper plating and electroplating solution technology, which is applied in the field of direct cyanide-free copper plating electroplating solution and electroplating on steel substrates, can solve the problems of limiting the application range of copper plating products, peeling, etc., and achieve the suppression of side reactions of hydrogen evolution, change of concentration, The effect of improving the bonding force of the coating

Active Publication Date: 2021-06-04
山东夸克电化学科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The copper plating layer has a strong bonding force, and the plating layer is 150 μm firm to meet GB5270-2005, but when the plating layer exceeds 200 μm, peeling occurs, which limits the application range of copper plating products

Method used

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  • Electroplating solution for direct cyanide-free copper plating of steel matrix under strong acidic condition and preparation method of electroplating solution
  • Electroplating solution for direct cyanide-free copper plating of steel matrix under strong acidic condition and preparation method of electroplating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A direct cyanide-free copper plating electroplating solution for iron and steel substrates under strongly acidic conditions, each component and content are as shown in Table 1;

[0025] The preparation method of this electroplating solution comprises the steps:

[0026] Take 1 / 2 volume of pure water, add copper sulfate to it and stir to dissolve, then add strong acid to it under continuous stirring, then add compound adsorbent and additives in turn and stir evenly, add the rest of pure water to the required volume Electroplating can be carried out after the copper plating solution is obtained.

[0027] Table 1 is the electroplating solution of embodiment 1:

[0028] Components and Operating Conditions Contentg / L Copper chloride 100 sulfuric acid 200 formic acid 20 Phenylthiourea 0.3 ammonium chloride 30 ammonia 70 Herotropine 1 Aliphatic amine polyoxyethylene ether 0.2 Electrode current density (A / dm ...

Embodiment 2

[0036] A direct cyanide-free copper plating electroplating solution for iron and steel substrates under strong acidic conditions, each component and content are as shown in Table 2;

[0037] The preparation method of the electroplating solution includes the following steps: take 1 / 2 volume of pure water, add copper sulfate to it and stir to dissolve, add strong acid to it under continuous stirring, and then add compound adsorbent and additives in turn and stir evenly , add the remaining amount of pure water to the required volume to obtain a copper plating solution, and then perform electroplating.

[0038] The copper plating solution of table 2 embodiment 2:

[0039] Components and Operating Conditions Contentg / L copper sulfate 100 sulfuric acid 150 formic acid 30 Cucurbituril 2 ammonia 20 ammonium bromide 30 ascorbic acid 1 polyethylene glycol 0.3 Cathode current density (A / dm 2 )

3 Plating time (min) ...

Embodiment 3

[0047] A direct cyanide-free copper plating electroplating solution for iron and steel substrates under strong acidic conditions, each component and content are as shown in Table 3;

[0048] The preparation method of this electroplating solution comprises the steps:

[0049] Take 1 / 2 volume of pure water, add copper sulfate to it and stir to dissolve, then add strong acid to it under continuous stirring, then add compound adsorbent and additives in turn and stir evenly, add the rest of pure water to the required volume Electroplating can be carried out after the copper plating solution is obtained.

[0050] The copper plating solution of table 3 embodiment 3:

[0051]

[0052] Electroplating method: the steel test piece is degreased, pickled, and activated in sequence, and then placed in the electroplating tank for electroplating, and the current density is set to 3 A / dm 2 , electroplating at room temperature for 10 min to complete the copper plating of steel. It is foun...

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Abstract

The invention discloses an electroplating solution for direct cyanide-free copper plating of a steel matrix under the strong acidic condition. The electroplating solution comprises the following components: 50-250 g / L of main salt, 30-100 g / L of a compound adsorbent, 1-5 g / L of an additive and 160-300 g / L of a strong acid composition. The effect that 1 + 1 is larger than 2 is generated through the synergistic effect of the compound adsorbent, the additive and the strong acid composition, the speed of the iron-copper replacement reaction under the strong acidic condition is effectively restrained, the steel matrix forms a simple substance copper layer with firm binding force at the moment of making contact with an acid plating solution, the content of sulfuric acid is 150-250 g / L, the technical problem that the acidity is higher, a plating layer is looser is solved, and the plating layer is still firm when reaching 300 [mu]m.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to a direct cyanide-free copper plating electroplating solution and an electroplating method for iron and steel substrates under strongly acidic conditions. Background technique [0002] Since the advent of electroplating technology for more than 100 years, direct acid copper plating on steel substrates has been considered a "forbidden zone" by peers and considered unfeasible. According to the metal activity sequence table: K, Na, Ca, Mg, Al, Zn, Fe, Sn, Pb, (H), Cu, Hg, Ag, Pt, Au, after the steel substrate workpiece enters the acidic copper plating solution A replacement reaction will occur instantaneously: Fe+CuS0 4 =Cu+FeS0 4 Generates a replacement copper layer with very poor tissue loose bonding. Generally, the higher the acid content in the copper plating solution, the faster the replacement reaction, the rougher the copper plating layer and the poorer t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 张志梁
Owner 山东夸克电化学科技有限公司
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